@inproceedings{9002b74f46c54593af8100d342efef03,
title = "An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology",
abstract = "2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.",
author = "Jie Zhang and Wei Lu and Huang, {Po Tsang} and Li, {Sih Han} and Hung, {Tsung Yi} and Wu, {Shih Hsien} and Dai, {Ming Ji} and Chung, {I. Shan} and Chen, {Wen Chao} and Wang, {Chin Hung} and Sheu, {Shyh Shyuan} and Chen, {Hung Ming} and Chen, {Kuan Neng} and Lo, {Wei Chung} and Wu, {Chih I.}",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 ; Conference date: 12-06-2022 Through 17-06-2022",
year = "2022",
doi = "10.1109/VLSITechnologyandCir46769.2022.9830188",
language = "English",
series = "Digest of Technical Papers - Symposium on VLSI Technology",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "262--263",
booktitle = "2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022",
address = "United States",
}