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AlN Passivation Technique for Ultra-Thin Barrier GaN Power Devices Demonstrating High Output Current and Low Current Degradation
Chen Hsi Tsai, Jui Sheng Wu,
Edward Yi Chang
材料科學與工程學系
智慧半導體奈米系統技術研究中心
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Conference contribution
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Keyphrases
GaN Power Device
100%
Passivation Effect
100%
Current Degradation
100%
High Output Current
100%
Low Current
100%
AlN Passivation
100%
Ultra-thin Barrier
100%
Metal-organic Chemical Vapor Deposition (MOCVD)
50%
Ultrathin
50%
Drain Current
50%
Device Characteristics
50%
High Electron Mobility Transistor
50%
On-state Resistance
50%
Power Device
50%
Device Application
50%
AlGaN Barrier
50%
Passivated
50%
Barrier Structure
50%
Metal-insulator-semiconductor
50%
Barrier Element
50%
Engineering
Passivation
100%
Current Output
100%
Power Device
100%
Current Drain
50%
Material Science
Aluminum Nitride
100%
Power Device
100%
Transistor
50%
Electron Mobility
50%