@inproceedings{0de153843cc846a29c844501d09f0523,
title = "Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force",
abstract = "As for AgNWs arrays for solar cell applications, our goal is to deposit AgNWs arrays on solar cells for enhancing photovoltaic conversion efficiency. The resulting alignment is ideal when AgNWs arrays are aligned on interdigitated electrodes by dielectrophoresis force in previous experiments, but not for aligning AgNWs arrays directly on silicon solar cell with pyramidal structure texture. In order to solve the limitations, the alignment is integrated with the transfer printing technique, and the fabrication approach is low-cost, fast, and scalable to large-area NW arrays, which offers flexible applications for developing NW-based devices with unconventional substrates.",
keywords = "Array, Dielectrophoresis force, Optoelectronics, Silver Nanowires, Transfer Printing",
author = "Chen, {Yen Shuo} and Liu, {Shun Yu} and Lin, {Ching Chang} and Fan, {Hua Tai} and Ko, {Yu Chien} and Chen, {Chun Chi} and Ko, {Fu Hsiang}",
note = "Publisher Copyright: {\textcopyright} 2024 Japan Institute of Electronics Packaging.; 23rd International Conference on Electronics Packaging, ICEP 2024 ; Conference date: 17-04-2024 Through 20-04-2024",
year = "2024",
doi = "10.23919/ICEP61562.2024.10535648",
language = "English",
series = "2024 International Conference on Electronics Packaging, ICEP 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "255--256",
booktitle = "2024 International Conference on Electronics Packaging, ICEP 2024",
address = "United States",
}