Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force

Yen Shuo Chen, Shun Yu Liu, Ching Chang Lin, Hua Tai Fan, Yu Chien Ko, Chun Chi Chen, Fu Hsiang Ko

研究成果: Conference contribution同行評審

摘要

As for AgNWs arrays for solar cell applications, our goal is to deposit AgNWs arrays on solar cells for enhancing photovoltaic conversion efficiency. The resulting alignment is ideal when AgNWs arrays are aligned on interdigitated electrodes by dielectrophoresis force in previous experiments, but not for aligning AgNWs arrays directly on silicon solar cell with pyramidal structure texture. In order to solve the limitations, the alignment is integrated with the transfer printing technique, and the fabrication approach is low-cost, fast, and scalable to large-area NW arrays, which offers flexible applications for developing NW-based devices with unconventional substrates.

原文English
主出版物標題2024 International Conference on Electronics Packaging, ICEP 2024
發行者Institute of Electrical and Electronics Engineers Inc.
頁面255-256
頁數2
ISBN(電子)9784991191176
DOIs
出版狀態Published - 2024
事件23rd International Conference on Electronics Packaging, ICEP 2024 - Toyama, Japan
持續時間: 17 4月 202420 4月 2024

出版系列

名字2024 International Conference on Electronics Packaging, ICEP 2024

Conference

Conference23rd International Conference on Electronics Packaging, ICEP 2024
國家/地區Japan
城市Toyama
期間17/04/2420/04/24

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