Advanced crystal component package with silicon TSV interposer using 3D integration and novel SU-8 polymer sealing bonding structure

Jian Yu Shih, Yen Chi Chen, Shih Wei Lee, Yu Chen Hu, Chih Hung Chiu, Chung Lun Lo, Chi Chung Chang, Kuan Neng Chen

研究成果: Conference contribution同行評審

摘要

In this paper, a novel crystal component package based on silicon TSV interposer substrate is demonstrated by using 3D integration technologies. It is distinct from conventional crystal component using ceramic-based substrate. This crystal component with advanced silicon-based substrate shows great manufacturability to replace traditional fabrication approach. In addition, the SU-8 sealing bonding structure provides the possibility to substitute for the conventional metal lid with reliability investigation. Finally, a novel silicon-based crystal component package with 3D integration is successfully fabricated through general semiconductor techniques to replace traditional manufacture.

原文English
主出版物標題2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
主出版物子標題Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面302-305
頁數4
ISBN(電子)9781479977277
DOIs
出版狀態Published - 1 一月 2014
事件9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
持續時間: 22 十月 201424 十月 2014

出版系列

名字2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Conference

Conference9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
國家/地區Taiwan
城市Taipei
期間22/10/1424/10/14

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