@inproceedings{b085dc5d0a9745f6bca192bda1c897fa,
title = "Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System",
abstract = "In this work, a novel biocompatible flexible heterogeneous integration platform has been developed. Using thermal compression bonding and conductive adhesive, three different functional devices, including sensing array, analog front-end chip, and LED array, are integrated on the flexible biocompatible substrate. Moreover, the whole exposed area of the platform is designed to be processed with biocompatible material. Thus, this structure is a promising integration scheme for the biomedical applications. Bending tests and reliability tests have been also performed to validate the feasibility of this flexible heterogeneous integration platform.",
keywords = "Bendable interconnect, Biocompatible, Flexible device, Heterogeneous integration, SU-8",
author = "Ku, {Shu Yun} and Chou, {Tzu Chieh} and Tsai, {Yi Chieh} and Chou, {Tzu Chieh} and Hu, {Han Wen} and Fang, {Yu Ren} and Lin, {Yu Ju} and Po-Tsang Huang and Jin-Chern Chiou and Kuan-Neng Chen",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE; null ; Conference date: 01-06-2021 Through 04-07-2021",
year = "2021",
doi = "10.1109/ECTC32696.2021.00167",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1020--1025",
booktitle = "Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021",
address = "United States",
}