Adhesion and material properties between polyimide and passivation layers for polymer/metal hybrid bonding in 3-D integration

Cheng Hsien Lu; Yi Tung Kho; Chiao Pei Chen; Bin Ling Tsai; Kuan-Neng Chen

doi:10.1109/TCPMT.2019.2895515

Adhesion and material properties between polyimide and passivation layers for polymer/metal hybrid bonding in 3-D integration

Cheng Hsien Lu, Yi Tung Kho, Chiao Pei Chen, Bin Ling Tsai, Kuan-Neng Chen^*

^*此作品的通信作者

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

摘要

This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 °C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.

原文	English
文章編號	8626542
頁（從 - 到）	412-418
頁數	7
期刊	IEEE Transactions on Components, Packaging and Manufacturing Technology
卷	9
發行號	3
DOIs	https://doi.org/10.1109/TCPMT.2019.2895515
出版狀態	Published - 3月 2019

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10.1109/TCPMT.2019.2895515

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title = "Adhesion and material properties between polyimide and passivation layers for polymer/metal hybrid bonding in 3-D integration",

abstract = "This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 °C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.",

keywords = "Adhesion, X-ray photoelectron spectroscopy (XPS), four-point bending, hybrid bonding, polyimide",

author = "Lu, {Cheng Hsien} and Kho, {Yi Tung} and Chen, {Chiao Pei} and Tsai, {Bin Ling} and Kuan-Neng Chen",

note = "Publisher Copyright: {\textcopyright} 2011-2012 IEEE.",

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AU - Lu, Cheng Hsien

AU - Kho, Yi Tung

AU - Chen, Chiao Pei

AU - Tsai, Bin Ling

AU - Chen, Kuan-Neng

PY - 2019/3

Y1 - 2019/3

N2 - This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 °C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.

AB - This paper investigates polymer/metal hybrid bonding structure using conventional polyimide and modified polyimide-like material. Adhesion properties between bonding material and passivation layer were evaluated by four-point bending method, atomic force microscopy, water contact angle measurement, and X-ray photoelectron spectroscopy. Various annealing temperatures were applied to verify the reliability under thermal stress. The results show that the modified polyimide-like material with the curing temperature below 250 °C has better adhesion than the conventional polyimide. This modified polyimide material can be used in low-temperature hybrid bonding technology for advanced integration.

KW - Adhesion

KW - X-ray photoelectron spectroscopy (XPS)

KW - four-point bending

KW - hybrid bonding

KW - polyimide

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Adhesion and material properties between polyimide and passivation layers for polymer/metal hybrid bonding in 3-D integration

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