TY - GEN
T1 - A Wideband mmWave Array Antenna Package Based on Glass Integrated Passive Device
AU - Gao, Donglin
AU - Khiabani, Neda
AU - Chiang, Ching Wen
AU - Kuan, Yen Cheng
AU - Michael Wu, Chung Tse
N1 - Publisher Copyright:
© 2022 The Institute of Electronics Information and Communication Engineers (IEICE) of Japan.
PY - 2022
Y1 - 2022
N2 - A mmWave antenna-in-package (AiP) design for a tightly connected bowtie array antenna using glass integrated passive device (GIPD) technology on a multilayer printed-circuit-board (PCB) is presented. The resulting GIPD antenna array is flip-chipped on the PCB using gold studs. The proposed 5 × 5 AiP array shows a bandwidth of 58 - 85 GHz, 89 - 94 GHz, and 98 - 100 GHz with differential VSWR = 3.5 through the measurement when the central antenna element is excited differentially through a vertical coax-via-based feeding structure. The simulated results are validated by measuring the fabricated prototype, demonstrating a reasonable agreement in differential VSWR and radiation characteristics.
AB - A mmWave antenna-in-package (AiP) design for a tightly connected bowtie array antenna using glass integrated passive device (GIPD) technology on a multilayer printed-circuit-board (PCB) is presented. The resulting GIPD antenna array is flip-chipped on the PCB using gold studs. The proposed 5 × 5 AiP array shows a bandwidth of 58 - 85 GHz, 89 - 94 GHz, and 98 - 100 GHz with differential VSWR = 3.5 through the measurement when the central antenna element is excited differentially through a vertical coax-via-based feeding structure. The simulated results are validated by measuring the fabricated prototype, demonstrating a reasonable agreement in differential VSWR and radiation characteristics.
KW - Antenna arrays
KW - antenna-in-package (AiP)
KW - glass integrated passive device (GIPD)
KW - metamaterials
KW - millimeter-wave (mmWave) antennas
UR - http://www.scopus.com/inward/record.url?scp=85146656927&partnerID=8YFLogxK
U2 - 10.23919/apmc55665.2022.9999945
DO - 10.23919/apmc55665.2022.9999945
M3 - Conference contribution
AN - SCOPUS:85146656927
T3 - Asia-Pacific Microwave Conference Proceedings, APMC
SP - 356
EP - 358
BT - 2022 Asia-Pacific Microwave Conference, APMC 2022 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 Asia-Pacific Microwave Conference, APMC 2022
Y2 - 29 November 2022 through 2 December 2022
ER -