@inproceedings{51d32a5d9b1440998b683db56ad4b785,
title = "A TSV noise-aware 3-D placer",
abstract = "In this work, a three-dimensional partitioning-based force-directed placer is developed to minimize coupling noise between through silicon vias (TSVs) in three-dimensional integrated circuits. TSV decoupling force is introduced and determined by the TSV coupling noise to separate TSVs with strong coupling noise. The experimental results indicate that TSV coupling noise can be effectively reduced by 36.3% on average with only 6.0% wirelength overhead. Besides, the developed 3-D placer shows great performance in wirelength that is competitive to a state-of-the-art 3-D placer.",
author = "Yu-Min Lee and Chun Chen and Jiaxing Song and Pan, {Kuan Te}",
year = "2015",
month = apr,
day = "22",
language = "English",
series = "Proceedings -Design, Automation and Test in Europe, DATE",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1653--1658",
booktitle = "Proceedings of the 2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015",
address = "United States",
note = "2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015 ; Conference date: 09-03-2015 Through 13-03-2015",
}