A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

Lei Chun Chou; Shih Wei Lee; Chuan An Cheng; Po-Tsang Huang; Chih Wei Chang; Cheng Hao Chiang; Shang Lin Wu; Ching Te Chuang; Jin-Chern Chiou; Wei Hwang; Chung Hsi Wu; Kuo Hua Chen; Chi Tsung Chiu; Ho Ming Tong; Kuan-Neng Chen

doi:10.1109/VLSI-TSA.2014.6839692

A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

Lei Chun Chou, Shih Wei Lee, Chuan An Cheng, Po-Tsang Huang, Chih Wei Chang, Cheng Hao Chiang, Shang Lin Wu, Ching Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

研究成果: Conference contribution › 同行評審

摘要

Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.

原文	English
主出版物標題	Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014
發行者	IEEE Computer Society
ISBN（列印）	9781479922178
DOIs	https://doi.org/10.1109/VLSI-TSA.2014.6839692
出版狀態	Published - 1 1月 2014
事件	2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014 - Hsinchu, Taiwan 持續時間: 28 4月 2014 → 30 4月 2014

出版系列

名字	Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014

Conference

Conference	2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014
國家/地區	Taiwan
城市	Hsinchu
期間	28/04/14 → 30/04/14

存取文件

10.1109/VLSI-TSA.2014.6839692

其它文件與鏈接

Link to publication in Scopus

引用此

Chou, L. C., Lee, S. W., Cheng, C. A., Huang, P-T., Chang, C. W., Chiang, C. H., Wu, S. L., Chuang, C. T., Chiou, J-C., Hwang, W., Wu, C. H., Chen, K. H., Chiu, C. T., Tong, H. M., & Chen, K-N. (2014). A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. 於 Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014 [6839692] (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014). IEEE Computer Society. https://doi.org/10.1109/VLSI-TSA.2014.6839692

Chou, Lei Chun ; Lee, Shih Wei ; Cheng, Chuan An 等. / A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014. IEEE Computer Society, 2014. (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014).

@inproceedings{0a2317eb88db48f9895952fdba66d074,

title = "A TSV-based heterogeneous integrated neural-signal recording device with microprobe array",

abstract = "Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.",

keywords = "Bio-Signal Probe, CMOS MEMS, TSV",

author = "Chou, {Lei Chun} and Lee, {Shih Wei} and Cheng, {Chuan An} and Po-Tsang Huang and Chang, {Chih Wei} and Chiang, {Cheng Hao} and Wu, {Shang Lin} and Chuang, {Ching Te} and Jin-Chern Chiou and Wei Hwang and Wu, {Chung Hsi} and Chen, {Kuo Hua} and Chiu, {Chi Tsung} and Tong, {Ho Ming} and Kuan-Neng Chen",

year = "2014",

month = jan,

day = "1",

doi = "10.1109/VLSI-TSA.2014.6839692",

language = "English",

isbn = "9781479922178",

series = "Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014",

publisher = "IEEE Computer Society",

booktitle = "Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014",

address = "United States",

note = "null ; Conference date: 28-04-2014 Through 30-04-2014",

}

Chou, LC, Lee, SW, Cheng, CA, Huang, P-T, Chang, CW, Chiang, CH, Wu, SL, Chuang, CT, Chiou, J-C, Hwang, W, Wu, CH, Chen, KH, Chiu, CT, Tong, HM & Chen, K-N 2014, A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. 於 Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014., 6839692, Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014, IEEE Computer Society, 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014, Hsinchu, Taiwan, 28/04/14. https://doi.org/10.1109/VLSI-TSA.2014.6839692

A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. / Chou, Lei Chun; Lee, Shih Wei; Cheng, Chuan An 等.

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014. IEEE Computer Society, 2014. 6839692 (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014).

研究成果: Conference contribution › 同行評審

TY - GEN

T1 - A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

AU - Chou, Lei Chun

AU - Lee, Shih Wei

AU - Cheng, Chuan An

AU - Huang, Po-Tsang

AU - Chang, Chih Wei

AU - Chiang, Cheng Hao

AU - Wu, Shang Lin

AU - Chuang, Ching Te

AU - Chiou, Jin-Chern

AU - Hwang, Wei

AU - Wu, Chung Hsi

AU - Chen, Kuo Hua

AU - Chiu, Chi Tsung

AU - Tong, Ho Ming

AU - Chen, Kuan-Neng

PY - 2014/1/1

Y1 - 2014/1/1

N2 - Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.

AB - Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.

KW - Bio-Signal Probe

KW - CMOS MEMS

KW - TSV

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SN - 9781479922178

T3 - Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014

BT - Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014

PB - IEEE Computer Society

Y2 - 28 April 2014 through 30 April 2014

ER -

Chou LC, Lee SW, Cheng CA, Huang P-T, Chang CW, Chiang CH 等. A TSV-based heterogeneous integrated neural-signal recording device with microprobe array. 於 Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014. IEEE Computer Society. 2014. 6839692. (Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2014). doi: 10.1109/VLSI-TSA.2014.6839692

A TSV-based heterogeneous integrated neural-signal recording device with microprobe array

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