A TSV-based bio-signal package with μ-probe array

Lei Chun Chou, Shih Wei Lee, Po-Tsang Huang, Chih Wei Chang, Cheng Hao Chiang, Shang Lin Wu, Ching Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.

原文English
文章編號6684308
頁(從 - 到)256-258
頁數3
期刊IEEE Electron Device Letters
35
發行號2
DOIs
出版狀態Published - 1 2月 2014

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