摘要
A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure holds the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.
原文 | English |
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文章編號 | 1012309 |
頁(從 - 到) | 2201-2204 |
頁數 | 4 |
期刊 | IEEE MTT-S International Microwave Symposium Digest |
卷 | 3 |
DOIs | |
出版狀態 | Published - 2 6月 2002 |
事件 | IEEE MTT-S International Microwave Symposium Digest - Seattle, WA, 美國 持續時間: 2 6月 2002 → 7 6月 2002 |