A semi-lumped balun fabricated by low temperature co-fired ceramic

Ching Wen Tang, Chi-Yang Chang*

*此作品的通信作者

研究成果: Conference article同行評審

46 引文 斯高帕斯(Scopus)

摘要

A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure holds the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.

原文English
文章編號1012309
頁(從 - 到)2201-2204
頁數4
期刊IEEE MTT-S International Microwave Symposium Digest
3
DOIs
出版狀態Published - 2 6月 2002
事件IEEE MTT-S International Microwave Symposium Digest - Seattle, WA, United States
持續時間: 2 6月 20027 6月 2002

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