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A quick overview of compact air-cooled heat sinks applicable for electronic cooling—recent progress
Chi-Chuan Wang
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此作品的通信作者
機械工程學系
研究成果
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Review article
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引文 斯高帕斯(Scopus)
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Keyphrases
Additional Pressure Drop
25%
Air Cooling
25%
Air-cooled Heat Sink
100%
Applicable Range
25%
Carbon Foam
25%
Choice Structure
25%
Competitive Performance
25%
Conventional Design
25%
Conventional Plate
25%
Cooling Applications
25%
Cross-cut Heat Sink
50%
Cross-flow
25%
Electronics Cooling
25%
Fin Design
25%
Fin Efficiency
25%
Fin Geometry
25%
Fin number
25%
Fin Spacing
25%
Fin Structure
25%
Fin Surface
25%
Forced Convection
25%
Grooved Surface
25%
Heat Sink
100%
High Velocity
25%
Large Temperature Difference
25%
Longitudinal Vortex Generator
25%
Louver
25%
Low Flow Rate
25%
Low Thermal Resistance
25%
Metal Foam
50%
Metal-carbon
25%
Module Design
25%
Novel Design
25%
Odd number
25%
Parallelogram
50%
Partial Bypass
50%
Plate Fin
25%
Porous Surface
25%
Pressure Drop
25%
Pressure Drop Penalty
25%
Rectangular Fin
25%
Rectangular Shape
25%
Single Cross
25%
Small Weight
25%
Solid Fins
25%
Surface Productivity
25%
Thermal Resistance
25%
Trapezoid
25%
Engineering
Cooling Air
50%
Fin Efficiency
50%
Fin Surface
50%
Flowrates
50%
Forced Convection
50%
Heat Resistance
100%
Metal Foam
100%
Module Design
50%
Odd Number
50%
Porosity
50%
Pressure Drop
100%
Solid Fin
50%
Vortex Generator
50%