A novel thermal switch design by using CMOS MEMS fabrication process

Lei Chun Chou*, You Liang Lai, Ying Zong Juang, Chun Yin Tsai, Chun Ying Lin, Sheng-Chieh Huang, Jin-Chern Chiou

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

The present study focuses on implementing a novel CMOS-MEMS thermal switch by using commercially available TSMC 0.35 μm two-poly four-metal (2P4M) CMOS process. There are two novel designs in this paper: first, the soft contact structure and post-processing fabrication; second, a new design of thermal actuator. To create the soft contact structure, residual stress effect has been utilized to make different bending curvatures. According to the experiments, the layer Metal1 has the largest residual stress [1] effect that can achieve the largest deflection in z-axis. Because the residual stress of the layer metal-1 is negative, the structure will bend down after release, the largest contact area which has been set up to get the lowest contact miss ability. In the post-processing fabrication, 0.3μm thickness gold will be patterned on the contact tips. Due to gold, rather than Aluminum, has no oxidation issue, it has more reliability on preventing the problem of oxidation than Aluminum. In the new thermal actuator design, we design a novel folded-flexure [2, 3] with the electrothermal excitation to turn the switch on or off. In the prototype, the device size is 500 μm * 400 μm and the gap between two contact pads is 9 μm in off-state. Depending on the simulation results, the switch can work stably at 3 volts, and the working temperature and operating bandwidth are individually 20-200 °C.

原文English
主出版物標題NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
頁面213-216
頁數4
DOIs
出版狀態Published - 2011
事件6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 - Kaohsiung, Taiwan
持續時間: 20 2月 201123 2月 2011

出版系列

名字NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Conference

Conference6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011
國家/地區Taiwan
城市Kaohsiung
期間20/02/1123/02/11

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