A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D Integration

Keyphrases

• 2.5D Integration 100%
• Bump 50%
• Current Mirror 50%
• Electrical Measurements 100%
• Fabrication Methods 50%
• Integrated Circuits 50%
• Line Pattern 50%
• Metal Line 50%
• Misalignment 50%
• Stacking Faults 50%
• Three-dimensional Integration 50%
• TSV Fabrication 50%

Engineering

• Current Mirror 50%
• Electrical Measurement 100%