A Novel Low-Temperature Cu-Cu Direct Bonding with Cr Wetting Layer and Au Passivation Layer

Demin Liu, Po Chih Chen, Kuan-Neng Chen

研究成果: Conference contribution同行評審

摘要

In this study, Cu-Cu direct bonding at the ultra-low bonding temperature has been successfully demonstrated by using the Cr/Au layer, which can protect Cu from oxidation before the thermocompression bonding (TCB) process and greatly improve the diffusion of Cu atoms into the surface during the thermal process. The bonding quality has been carefully investigated by analyzing Auger depth, observing the SAT, AFM, SEM images, and measuring electrical performance of the samples. In addition, the mechanical test and reliability test have been performed to verify the reliability of the novel structure with the Cr/Au layer in this study.

原文English
主出版物標題Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1322-1327
頁數6
ISBN(電子)9781728161808
DOIs
出版狀態Published - 六月 2020
事件70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
持續時間: 3 六月 202030 六月 2020

出版系列

名字Proceedings - Electronic Components and Technology Conference
2020-June
ISSN(列印)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
國家/地區United States
城市Orlando
期間3/06/2030/06/20

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