A novel array-based test methodology for local process variation monitoring

Tseng Chin Luo*, Chia-Tso Chao, Michael S.Y. Wu, Kuo Tsai Li, Chin C. Hsia, Huan Chi Tseng, Chuen Uan Huang, Yuan Yao Chang, Samuel C. Pan, Konrad K.L. Young

*此作品的通信作者

    研究成果: Conference contribution同行評審

    5 引文 斯高帕斯(Scopus)

    摘要

    As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC manufacturing. To monitor local process variation, a large number of DUTs (deviceunder- test) in close proximity must be measured. In this paper, we presents a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by utilizing the proposed hardware IR compensation and voltage bias elevation. Furthermore, the DUT layout need not be modified for the proposed test structure so that the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation.

    原文English
    主出版物標題International Test Conference, ITC 2009 - Proceedings
    DOIs
    出版狀態Published - 15 12月 2009
    事件International Test Conference, ITC 2009 - Austin, TX, United States
    持續時間: 1 11月 20096 11月 2009

    出版系列

    名字Proceedings - International Test Conference
    ISSN(列印)1089-3539

    Conference

    ConferenceInternational Test Conference, ITC 2009
    國家/地區United States
    城市Austin, TX
    期間1/11/096/11/09

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