A low-power mandarin-specific hearing aid chip

Cheng Wen Wei*, Yu Ting Kuo, Kuo Chiang Chang, Cheng Chun Tsai, Jihi Yu Lin, Yi FanJiang, Ming Hsien Tu, Chih-Wei Liu, Tian-Sheuan Chang, Shyh-Jye Jou

*此作品的通信作者

    研究成果: Conference contribution同行評審

    14 引文 斯高帕斯(Scopus)

    摘要

    This paper presents a digital hearing aid chip designed for Mandarin user to enhance speech quality and intelligibility. The hearing aid consists of an 18 subbands analysis and synthesis filter bank, insertion gain stage, and three channels wide dynamic range control for the new Mandarin-specific auditory compensation algorithm. A noise reduction block based on multiband spectral subtraction and enhanced entropy voice activity detection is also included to enhance quality. We reduce the power consumption of these algorithms through algorithmic and architecture optimization. In addition, for the data storage requirement, a low power SRAM that can operate at 0.6V and below is developed. Moreover, several strategies such as multi-clock domain, bypass mode, and voltage scaling are also adopted for power reduction. The chip measurement shows that the hearing aid consumes 314uW at 0.6V.

    原文English
    主出版物標題2010 IEEE Asian Solid-State Circuits Conference, A-SSCC 2010
    頁面333-336
    頁數4
    DOIs
    出版狀態Published - 1 12月 2010
    事件2010 6th IEEE Asian Solid-State Circuits Conference, A-SSCC 2010 - Beijing, 中國
    持續時間: 8 11月 201010 11月 2010

    出版系列

    名字2010 IEEE Asian Solid-State Circuits Conference, A-SSCC 2010

    Conference

    Conference2010 6th IEEE Asian Solid-State Circuits Conference, A-SSCC 2010
    國家/地區中國
    城市Beijing
    期間8/11/1010/11/10

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