TY - JOUR
T1 - A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies
AU - Chiang, Ching Wen
AU - Wu, Chung Tse Michael
AU - Liu, Nai Chen
AU - Liang, Chia Jen
AU - Kuan, Yen Cheng
N1 - Publisher Copyright:
© 2011-2012 IEEE.
PY - 2022/5/1
Y1 - 2022/5/1
N2 - This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.
AB - This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.
KW - Antenna-in-package (AiP)
KW - W-band
KW - bumps
KW - cavity antenna
KW - flip-chip
KW - grounded coplanar waveguide (GCPW)
KW - heterogeneous integration (HI)
KW - integrated passive device (IPD)
KW - millimeter-wave (mmWave)
KW - printed circuit board (PCB)
KW - substrate-integrated waveguide (SIW)
UR - http://www.scopus.com/inward/record.url?scp=85129410113&partnerID=8YFLogxK
U2 - 10.1109/TCPMT.2022.3170499
DO - 10.1109/TCPMT.2022.3170499
M3 - Article
AN - SCOPUS:85129410113
SN - 2156-3950
VL - 12
SP - 822
EP - 827
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 5
ER -