A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

Ching Wen Chiang; Chung Tse Michael Wu; Nai Chen Liu; Chia Jen Liang; Yen Cheng Kuan

doi:10.1109/TCPMT.2022.3170499

A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

Ching Wen Chiang, Chung Tse Michael Wu, Nai Chen Liu, Chia Jen Liang, Yen Cheng Kuan

國際半導體產業學院

研究成果: Article › 同行評審

摘要

This paper presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built by using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio-frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.

原文	English
期刊	IEEE Transactions on Components, Packaging and Manufacturing Technology
DOIs	https://doi.org/10.1109/TCPMT.2022.3170499
出版狀態	Accepted/In press - 2022

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10.1109/TCPMT.2022.3170499

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@article{48f85d4142394fcfba625975e87d8e88,

title = "A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies",

abstract = "This paper presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built by using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio-frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.",

keywords = "Antenna measurements, Antenna radiation patterns, antenna-in-package (AiP), Antennas, bumps, cavity antenna, flip-chip, grounded coplanar waveguide (GCPW), heterogeneous integration, integrated passive device (IPD), Metals, millimeter-wave (mmWave), Packaging, printed circuit board (PCB), Silicon, substrate integrated waveguide (SIW), Substrates, W-band",

author = "Chiang, {Ching Wen} and Wu, {Chung Tse Michael} and Liu, {Nai Chen} and Liang, {Chia Jen} and Kuan, {Yen Cheng}",

note = "Publisher Copyright: IEEE",

year = "2022",

doi = "10.1109/TCPMT.2022.3170499",

language = "English",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

AU - Chiang, Ching Wen

AU - Wu, Chung Tse Michael

AU - Liu, Nai Chen

AU - Liang, Chia Jen

AU - Kuan, Yen Cheng

N1 - Publisher Copyright: IEEE

PY - 2022

Y1 - 2022

N2 - This paper presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built by using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio-frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.

AB - This paper presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built by using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio-frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.

KW - Antenna measurements

KW - Antenna radiation patterns

KW - antenna-in-package (AiP)

KW - Antennas

KW - bumps

KW - cavity antenna

KW - flip-chip

KW - grounded coplanar waveguide (GCPW)

KW - heterogeneous integration

KW - integrated passive device (IPD)

KW - Metals

KW - millimeter-wave (mmWave)

KW - Packaging

KW - printed circuit board (PCB)

KW - Silicon

KW - substrate integrated waveguide (SIW)

KW - Substrates

KW - W-band

UR - http://www.scopus.com/inward/record.url?scp=85129410113&partnerID=8YFLogxK

U2 - 10.1109/TCPMT.2022.3170499

DO - 10.1109/TCPMT.2022.3170499

M3 - Article

AN - SCOPUS:85129410113

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

SN - 2156-3950

ER -

A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

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