A Combined Spin Coating and Lift-Off Process (CSLOP) to Realize Thick Silver Microstructures with a High Aspect Ratio for IoT Applications

Chi Fu Huang, Ray Tung Chiang, Yu Ting Cheng

研究成果: Conference contribution同行評審

摘要

This paper presents a new manufacturing technology, i.e., combined spin coating and lift-off process (CSLOP), for the fabrication of Ag interconnects and microstructures such as interconnect lines, interdigitated capacitors and spiral inductors with a high aspect ratio of thickness vs. width. For the interconnect fabrication using the thin film CSLOP, Ag lines with a width range from 10 to 100 can be realized with an electrical resistivity of 2.36Omega\cdot \cm, only 1.48 × higher than that of bulk silver (1.59Omega\cdot \cm), which is the lowest resistive Ag line ever reported. For high performance on-chip flexible passive fabrication using the thick film CSLOP, the interdigitated capacitors with an electrode thickness of 70 can exhibit a capacitance of 0.502pF@10 kHz and the 5-turn, 70 thick spiral inductor can have high Q performance with a highest inductance density up to 9.7 nH/mm2. Because the process scheme can be applied using other metal/metal oxide nanoparticles, the CSLOP can facilitate the realization of highly sensitive sensors and excellent heterogeneous integration for IOT applications.

原文English
主出版物標題21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1122-1125
頁數4
ISBN(電子)9781665412674
DOIs
出版狀態Published - 20 6月 2021
事件21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 - Virtual, Online, United States
持續時間: 20 6月 202125 6月 2021

出版系列

名字21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021

Conference

Conference21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
國家/地區United States
城市Virtual, Online
期間20/06/2125/06/21

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