TY - GEN
T1 - A CMOS-MEMS Pressure Sensor with Integrated Front-End for Chemical Vapor Deposition Systems
AU - Tsai, Tsung Heng
AU - Hong, Song You
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - In this paper, a CMOS-MEMS capacitive pressure sensor is designed for low-pressure chemical vapor deposition (LPCVD) systems. A buffer layer is utilized in the proposed pressure transducer to effectively protect the sensing diaphragm from breaking down while maintaining high linearity with a compact dimension. A low-power front-end readout circuit is implemented on the same chip to convert the capacitance variance to digital outputs according to the pressure change in the chemical vapor deposition process, near vacuum in this design. The presented device is fabricated through UMC 0.18μm 1P6M CMOS process, and in-house post-processes. The chip size is 1.5×1.5 mm2. Experimental results show that the sensitivity of 0.655 fF/Pa is realized in the range of 0 - 600 Pa.
AB - In this paper, a CMOS-MEMS capacitive pressure sensor is designed for low-pressure chemical vapor deposition (LPCVD) systems. A buffer layer is utilized in the proposed pressure transducer to effectively protect the sensing diaphragm from breaking down while maintaining high linearity with a compact dimension. A low-power front-end readout circuit is implemented on the same chip to convert the capacitance variance to digital outputs according to the pressure change in the chemical vapor deposition process, near vacuum in this design. The presented device is fabricated through UMC 0.18μm 1P6M CMOS process, and in-house post-processes. The chip size is 1.5×1.5 mm2. Experimental results show that the sensitivity of 0.655 fF/Pa is realized in the range of 0 - 600 Pa.
KW - Capacitive pressure sensor
KW - CMOS MEMS
KW - Time-to-digital converter
UR - http://www.scopus.com/inward/record.url?scp=85179759676&partnerID=8YFLogxK
U2 - 10.1109/SENSORS56945.2023.10325313
DO - 10.1109/SENSORS56945.2023.10325313
M3 - Conference contribution
AN - SCOPUS:85179759676
T3 - Proceedings of IEEE Sensors
BT - 2023 IEEE SENSORS, SENSORS 2023 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE SENSORS, SENSORS 2023
Y2 - 29 October 2023 through 1 November 2023
ER -