TY - GEN
T1 - A CMOS accelerometer using bondwire inertial sensing
AU - Liao, Yu-Te
AU - Biederman, W.
AU - Otis, B.
PY - 2009/6/16
Y1 - 2009/6/16
N2 - This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 m CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply .
AB - This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 m CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply .
UR - http://www.scopus.com/inward/record.url?scp=70449379051&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:70449379051
SN - 9784863480018
T3 - IEEE Symposium on VLSI Circuits, Digest of Technical Papers
SP - 64
EP - 65
BT - 2009 Symposium on VLSI Circuits
T2 - 2009 Symposium on VLSI Circuits
Y2 - 16 June 2009 through 18 June 2009
ER -