In this paper, a back-to-back micromirror device fabricated through surface-micromachining and flip chip packaging technologies is developed for optical add/drop multiplexer applications. Pre-stressed beams were designed to elevate micromirror devices after the release and thermal heat-treatment processes. Torsion flexure structure design provides a reliable rotation degree of freedom for micromirror devices. A mechanical stopper was bonded using flip chip packaging on the top of micromirror devices to constrain the popped-up micromirror to obtain precise deflecting angle. Preliminary experiments had demonstrated the feasibility of the micromirror devices.
|頁（從 - 到）||473-479|
|期刊||Proceedings of SPIE - The International Society for Optical Engineering|
|出版狀態||Published - 19 5月 2003|
|事件||Smart Sensors, Actuators, and MEMS - Maspalonas, Gran Canaria, Spain|
持續時間: 19 5月 2003 → 21 5月 2003