A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang, Po-Tsang Huang, Yu Chen Hu, Shang Lin Wu, Yan Huei You, Yung Kuei Wang, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching Te Chuang, Jin-Chern Chiou

研究成果: Paper同行評審

摘要

To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.
原文American English
DOIs
出版狀態Published - 7月 2017
事件19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan
持續時間: 18 6月 201722 6月 2017

Conference

Conference19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
國家/地區Taiwan
城市Kaohsiung
期間18/06/1722/06/17

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