A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

Yu Chen Lo; Yi Chung Wu; Chia Hsiang Yang

doi:10.1109/VLSITechnologyandCir46769.2022.9830370

A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

Yu Chen Lo
, Yi Chung Wu
, Chia Hsiang Yang

電子研究所

研究成果: Conference contribution › 同行評審

2 引文斯高帕斯（Scopus）

摘要

This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57%. The reconfigurable PE datapath enables 92.7% utilization with 38.1% less area. Data sparsity is leveraged for clock gating, saving 32.2% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.

原文	English
主出版物標題	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	74-75
頁數	2
ISBN（電子）	9781665497725
DOIs	https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830370
出版狀態	Published - 2022
事件	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, 美國持續時間: 12 6月 2022 → 17 6月 2022

出版系列

名字	Digest of Technical Papers - Symposium on VLSI Technology
卷	2022-June
ISSN（列印）	0743-1562

Conference

Conference	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
國家/地區	美國
城市	Honolulu
期間	12/06/22 → 17/06/22

UN SDG

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存取文件

10.1109/VLSITechnologyandCir46769.2022.9830370

其它文件與鏈接

Link to publication in Scopus

引用此

Lo, Y. C., Wu, Y. C., & Yang, C. H. (2022). A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing. 於 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 (頁 74-75). (Digest of Technical Papers - Symposium on VLSI Technology; 卷 2022-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830370

@inproceedings{9eb71b37443c4d9abdaf5863c59e53bb,

title = "A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing",

abstract = "This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57\%. The reconfigurable PE datapath enables 92.7\% utilization with 38.1\% less area. Data sparsity is leveraged for clock gating, saving 32.2\% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.",

author = "Lo, \{Yu Chen\} and Wu, \{Yi Chung\} and Yang, \{Chia Hsiang\}",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 ; Conference date: 12-06-2022 Through 17-06-2022",

year = "2022",

doi = "10.1109/VLSITechnologyandCir46769.2022.9830370",

language = "English",

series = "Digest of Technical Papers - Symposium on VLSI Technology",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "74--75",

booktitle = "2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022",

address = "美國",

}

Lo, YC, Wu, YC & Yang, CH 2022, A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing. 於 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Digest of Technical Papers - Symposium on VLSI Technology, 卷 2022-June, Institute of Electrical and Electronics Engineers Inc., 頁 74-75, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, Honolulu, 美國, 12/06/22. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830370

A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing. / Lo, Yu Chen; Wu, Yi Chung; Yang, Chia Hsiang.
2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 74-75 (Digest of Technical Papers - Symposium on VLSI Technology; 卷 2022-June).

研究成果: Conference contribution › 同行評審

TY - GEN

T1 - A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

AU - Lo, Yu Chen

AU - Wu, Yi Chung

AU - Yang, Chia Hsiang

PY - 2022

Y1 - 2022

N2 - This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57%. The reconfigurable PE datapath enables 92.7% utilization with 38.1% less area. Data sparsity is leveraged for clock gating, saving 32.2% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.

AB - This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57%. The reconfigurable PE datapath enables 92.7% utilization with 38.1% less area. Data sparsity is leveraged for clock gating, saving 32.2% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.

UR - https://www.scopus.com/pages/publications/85135236224

U2 - 10.1109/VLSITechnologyandCir46769.2022.9830370

DO - 10.1109/VLSITechnologyandCir46769.2022.9830370

M3 - Conference contribution

AN - SCOPUS:85135236224

T3 - Digest of Technical Papers - Symposium on VLSI Technology

SP - 74

EP - 75

BT - 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022

Y2 - 12 June 2022 through 17 June 2022

ER -

A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

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