TY - GEN
T1 - A 2W 9.5-16.5 GHz GaN Power Amplifier with 30% PAE Using Transformer-Based Output Matching Network
AU - Sun, Xiao
AU - Zhu, Xu
AU - Wang, Yong
AU - Chi, Pei Ling
AU - Yang, Tao
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - In this paper, a 9.5-16.5 GHz power amplifier (PA) with power-added efficiency (PAE) of 30% and output power of 2W is proposed in 0.25 µm GaN technology. A two-stage PA is implemented to achieve enough power gain. In order to obtain wide bandwidth at high frequency, a transformer output matching network is proposed, which absorbs the parasitic capacitance of the transistor. Compared to conventional single stage of transformer matching network, the proposed matching network can not only significantly extend matching bandwidth, but also does not add any extra circuit complexity, keeping a high PAE and compact chip size. With this technique, the measured PA produces a saturated output power of 33.1-34.7 dBm over 9.5-16.5 GHz band with 30.1-35.9 % PAE. The large signal gain varies between 11.1-12.7 dB. The chip size is 2.9 mm ×1.2 mm, including bondpads.
AB - In this paper, a 9.5-16.5 GHz power amplifier (PA) with power-added efficiency (PAE) of 30% and output power of 2W is proposed in 0.25 µm GaN technology. A two-stage PA is implemented to achieve enough power gain. In order to obtain wide bandwidth at high frequency, a transformer output matching network is proposed, which absorbs the parasitic capacitance of the transistor. Compared to conventional single stage of transformer matching network, the proposed matching network can not only significantly extend matching bandwidth, but also does not add any extra circuit complexity, keeping a high PAE and compact chip size. With this technique, the measured PA produces a saturated output power of 33.1-34.7 dBm over 9.5-16.5 GHz band with 30.1-35.9 % PAE. The large signal gain varies between 11.1-12.7 dB. The chip size is 2.9 mm ×1.2 mm, including bondpads.
KW - high efficiency
KW - power amplifiers
KW - transformer
UR - http://www.scopus.com/inward/record.url?scp=85168552003&partnerID=8YFLogxK
U2 - 10.1109/IMS37964.2023.10188054
DO - 10.1109/IMS37964.2023.10188054
M3 - Conference contribution
AN - SCOPUS:85168552003
T3 - IEEE MTT-S International Microwave Symposium Digest
SP - 319
EP - 322
BT - 2023 IEEE/MTT-S International Microwave Symposium, IMS 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE/MTT-S International Microwave Symposium, IMS 2023
Y2 - 11 June 2023 through 16 June 2023
ER -