TY - JOUR
T1 - A (21150, 19050) GC-LDPC Decoder for NAND flash applications
AU - Liao, Yen Chin
AU - Lin, Chien
AU - Chang, Hsie-Chia
AU - Lin, Shu
PY - 2019/3/1
Y1 - 2019/3/1
N2 - In this paper, a (21150, 19050) globally-coupled low-density parity check (GC-LDPC) code designed for NAND flash memories is presented. The proposed LDPC code comprises three disjoint subcodes which can be decoded independently. This highly structural parity check matrix contributes to efficient decoder implementation and flexible decoding flow control. Moreover, a two-phase local/global decoding procedure optimized for the proposed GC-LDPC code is introduced. Scenarios of collaborative decoding that leverages the special code structures are discussed. In the proposed decoder architecture, the pipelined processing elements with scheduling are employed to reduce the critical path and decoding latency as well. Implemented in UMC 65 nm process, the post-layout simulation shows a maximum decoding throughput of 4.32 Gb/s with the chip area 3.376 mm 2 .
AB - In this paper, a (21150, 19050) globally-coupled low-density parity check (GC-LDPC) code designed for NAND flash memories is presented. The proposed LDPC code comprises three disjoint subcodes which can be decoded independently. This highly structural parity check matrix contributes to efficient decoder implementation and flexible decoding flow control. Moreover, a two-phase local/global decoding procedure optimized for the proposed GC-LDPC code is introduced. Scenarios of collaborative decoding that leverages the special code structures are discussed. In the proposed decoder architecture, the pipelined processing elements with scheduling are employed to reduce the critical path and decoding latency as well. Implemented in UMC 65 nm process, the post-layout simulation shows a maximum decoding throughput of 4.32 Gb/s with the chip area 3.376 mm 2 .
KW - Globally-coupled LDPC codes
KW - emerging memory ECC
KW - two-phase local/global iterative decoding
UR - http://www.scopus.com/inward/record.url?scp=85056313927&partnerID=8YFLogxK
U2 - 10.1109/TCSI.2018.2875311
DO - 10.1109/TCSI.2018.2875311
M3 - Article
AN - SCOPUS:85056313927
SN - 1549-8328
VL - 66
SP - 1219
EP - 1230
JO - IEEE Transactions on Circuits and Systems I: Regular Papers
JF - IEEE Transactions on Circuits and Systems I: Regular Papers
IS - 3
M1 - 8528505
ER -