A 20Gb/s 79.5mW 127GHz CMOS transceiver with digitally pre-distorted PAM-4 modulation for contactless communications

Yanghyo Kim, Boyu Hu, Yuan Du, Adrian Tang, Huan Neng Chen, Chewnpu Jou, Jason Cong, Tatsuo Itoh, Mau-Chung Chang

    研究成果: Conference contribution同行評審

    7 引文 斯高帕斯(Scopus)

    摘要

    Contactless chip-to-chip or board-to-board proximity (∼1mm) communications have been realized by using either wireless transmission [1-3], or inductive/capacitive coupling schemes [4-6]. However, their practical deployments in consumer electronics are currently limited because of bandwidth-density-inefficient OOK/ASK-only modulations [1-3], process/voltage/temperature sensitive carrier-recovery-less coherent detection [1], and large coupler footprint (6∼10mm2) for meeting bandwidth requirements [1], [4-6]. To overcome such challenges, the demonstrated contactless communication system employs a 127GHz CMOS transceiver to concurrently increase the coupling bandwidth and reduce coupling antenna size. Furthermore, a PAM-4 modulator with digital pre-distortion (DPD) in the transmitter (TX) and an envelope detecting non-coherent receiver (RX) are designed to further scale the bandwidth and eliminate carrier recovery circuitry, respectively.

    原文English
    主出版物標題2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
    發行者Institute of Electrical and Electronics Engineers Inc.
    頁面278-280
    頁數3
    ISBN(電子)9781509049394
    DOIs
    出版狀態Published - 8 三月 2018
    事件65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States
    持續時間: 11 二月 201815 二月 2018

    出版系列

    名字Digest of Technical Papers - IEEE International Solid-State Circuits Conference
    61
    ISSN(列印)0193-6530

    Conference

    Conference65th IEEE International Solid-State Circuits Conference, ISSCC 2018
    國家/地區United States
    城市San Francisco
    期間11/02/1815/02/18

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