TY - GEN
T1 - A 1 v 59 fJ/Step 15 MHz BW 74 dB SNDR continuous-time ΔΣ modulator with digital ELD compensation and multi-bit FIR feedback
AU - Zhang, Yi
AU - Chen, Chia Hung
AU - He, Tao
AU - Meng, Xin
AU - Qian, Nancy
AU - Liu, Ed
AU - Elliott, Phillip
AU - Temes, Gabor C.
PY - 2015/1/13
Y1 - 2015/1/13
N2 - A 3rd-order continuous-time ΔΣ modulator with a highly-digital excess loop delay compensation and multi-bit FIR feedback, to be used in an ultrasound beamformer, is presented. A digitally controlled reference switching matrix avoids the power-hungry adder, and allows a power-efficient design of the loop filter. A 2-bit 3-tap FIR feedback DAC optimally achieves lower sensitivity to clock jitter and applies reduced error signal to the loop filter, thus enhancing the loop filter linearity. The modulator operates at 1.2 GHz, and achieves 79.4 dB dynamic range, 77.3 dB SNR and 74.3 dB SNDR over a 15 MHz signal bandwidth. Fabricated in a 65 nm CMOS process, the core modulator occupies 0.16 mm2 and dissipates 6.96mW from a 1 V supply. A 58.6 fJ/conversion-step figure of merit is achieved.
AB - A 3rd-order continuous-time ΔΣ modulator with a highly-digital excess loop delay compensation and multi-bit FIR feedback, to be used in an ultrasound beamformer, is presented. A digitally controlled reference switching matrix avoids the power-hungry adder, and allows a power-efficient design of the loop filter. A 2-bit 3-tap FIR feedback DAC optimally achieves lower sensitivity to clock jitter and applies reduced error signal to the loop filter, thus enhancing the loop filter linearity. The modulator operates at 1.2 GHz, and achieves 79.4 dB dynamic range, 77.3 dB SNR and 74.3 dB SNDR over a 15 MHz signal bandwidth. Fabricated in a 65 nm CMOS process, the core modulator occupies 0.16 mm2 and dissipates 6.96mW from a 1 V supply. A 58.6 fJ/conversion-step figure of merit is achieved.
UR - http://www.scopus.com/inward/record.url?scp=84922541144&partnerID=8YFLogxK
U2 - 10.1109/ASSCC.2014.7008925
DO - 10.1109/ASSCC.2014.7008925
M3 - Conference contribution
AN - SCOPUS:84922541144
T3 - 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers
SP - 321
EP - 324
BT - 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
Y2 - 10 November 2014 through 12 November 2014
ER -