45nm node planar-SOI technology with 0.296μm2 6T-SRAM cell

Fu Liang Yang*, Cheng Chuan Huang, Chien Chao Huang, Tang Xuan Chung, Hou Yu Chen, Chang Yun Chang, Hung Wei Chen, Di Hong Lee, Sheng Da Liu, Kuang Hsin Chen, Cheng Kuo Wen, Shui Ming Cheng, Chang Ta Yang, Li Wei Kung, Chiu Lien Lee, Yu Jun Chou, Fu Jye Liang, Lin Hung Shiu, Jan Wen You, King Chang ShuBin Chang Chang, Jaw Jung Shin, Chun Kuang Chen, Tsai Sheng Gau, Ping Wei Wang, Bor Wen Chan, Peng Fu Hsu, Jyu Horng Shieh, Samuel K.H. Fung, Carlos H. Diaz, Chii Ming M. Wu, Yee Chaung See, Bum J. Lin, Mong Song Liang, Jack Y.C. Sun, Chen-Ming Hu

*此作品的通信作者

研究成果: Conference article同行評審

23 引文 斯高帕斯(Scopus)

摘要

The first 45nm node planar-SOI technology has been developed with 6T-SRAM cell of 0.296μm2. An adequate static noise margin of 120mV is obtained even at 0.6V operation. Fine patterning with line pitch of 130nm and contact pitch of 140nm by optical lithography is demonstrated. Transistors with 30nm gate length and 27nm slim spacer operate at IV/0.85V with excellent drive currents of 1000/740 and 530/420 μA/μm for N-FET and P-FET, respectively. The P-FET current is the best reported so far.

原文English
頁(從 - 到)8-9
頁數2
期刊Digest of Technical Papers - Symposium on VLSI Technology
DOIs
出版狀態Published - 2004
事件2004 Symposium on VLSI Technology - Digest of Technical Papers - Honolulu, HI, 美國
持續時間: 15 6月 200417 6月 2004

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