3D printed RF passive components by liquid metal filling

Chen Yang; Sung Yueh Wu; Casey Glick; Yun Seok Choi; Wen-Syang Hsu; Liwei Lin

doi:10.1109/MEMSYS.2015.7050938

3D printed RF passive components by liquid metal filling

Chen Yang, Sung Yueh Wu, Casey Glick, Yun Seok Choi, Wen-Syang Hsu, Liwei Lin

機械工程學系

研究成果: Conference article › 同行評審

20 引文斯高帕斯（Scopus）

摘要

We present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements and interconnects with high electrical conductivity. In the proof-of-concept demonstrations, various radio-frequency (RF) passive components, including 3D-shaped inductors, capacitors and resistors are fabricated and characterized. High-Q inductors and capacitors up to 1 GHz have been demonstrated. This work establishes an innovative way to construct arbitrary 3D electrical systems with efficient and labor-saving processes.

原文	English
文章編號	7050938
頁（從 - 到）	261-264
頁數	4
期刊	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
卷	2015-February
發行號	February
DOIs	https://doi.org/10.1109/MEMSYS.2015.7050938
出版狀態	Published - 26 2月 2015
事件	2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015 - Estoril, 葡萄牙持續時間: 18 1月 2015 → 22 1月 2015

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10.1109/MEMSYS.2015.7050938

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引用此

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AU - Glick, Casey

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AU - Lin, Liwei

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3D printed RF passive components by liquid metal filling

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