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3D-printed microelectronics for integrated circuitry and passive wireless sensors
Sung Yueh Wu, Chen Yang,
Wen-Syang Hsu
, Liwei Lin
*
*
此作品的通信作者
機械工程學系
研究成果
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267
引文 斯高帕斯（Scopus）
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Keyphrases
Circuitry
100%
Three-dimensional (3D)
100%
Microelectronics
100%
Passive Wireless Sensor
100%
Three-dimensional-printed
100%
Milk
50%
Capacitors
25%
Inductors
25%
Resonant Frequency
25%
Wirelessly
25%
3D Structure
25%
Room Temperature
25%
Resistors
25%
Sacrificial Structures
25%
Innovative Approach
25%
Support Structure
25%
Resonance Frequency Shift
25%
Electrical Components
25%
Juice
25%
Liquid Food
25%
Additive Manufacturing Techniques
25%
Silver Particles
25%
Good Characteristics
25%
Sacrificial Material
25%
Resonant Tank
25%
Metallic Elements
25%
Three-dimensional System
25%
Fused Deposition Modeling
25%
Microelectronic Components
25%
Temperature Environment
25%
Electrical Structure
25%
Wireless Passive Sensor
25%
Nozzle System
25%
Smart Cap
25%
Print Resolution
25%
Multiple Nozzles
25%
Material Science
Electronic Circuit
100%
Capacitor
100%
Silver
100%
Three Dimensional Printing
100%
Electrical Component
100%
Fused Filament Fabrication
100%
Engineering
Wireless Sensor
100%
Microelectronics
100%
Resonance Frequency
66%
Interconnects
33%
Dimensional Structure
33%
Dimensional System
33%
Room Temperature
33%
Additive Manufacturing Technique
33%
Frequency Shift
33%
Metallic Element
33%
Fused Deposition Modeling
33%
Printing Resolution
33%