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查看斯高帕斯 (Scopus) 概要
楊 元福
助理教授
智能系統研究所
電話
03-5712121#58529
電子郵件
yfyangd
nycu.edu
tw
網站
https://yfyangd.github.io/
h-index
h10-index
h5-index
93
引文
5
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
93
引文
5
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
60
引文
4
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
2006
2022
每年研究成果
概覽
指紋
網路
研究成果
(7)
類似的個人檔案
(5)
指紋
查看啟用 Yuan-Fu Yang 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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重量
按字母排序
Keyphrases
Wafer
98%
Defect Classification
94%
Semiconductor Defects
66%
Defect Detection
41%
Defect Pattern
40%
Deep Learning Architectures
38%
Double Features
33%
Wafer Map Classification
33%
Quantum Deep Learning
33%
Grouping Genetic Algorithm
33%
Preventive Maintenance
33%
Hybrid Quantum-classical
33%
Lithography Hotspot Detection
33%
Genetic Algorithm
33%
Semiconductor Wafer Map
33%
Feature Extraction Methods
33%
Convolution Neural Network
33%
Neural Network
33%
Deep Learning Model
33%
Self-proliferation
33%
Convolutional Neural Network
33%
Defect Identification
33%
Classification Basis
33%
Attention Neural Network
33%
Classical Machine Learning
33%
Automatic Defect Detection
30%
Defect Inspection
28%
Classification Performance
27%
Semiconductor Manufacturing
25%
Edge Devices
25%
Defect Review
22%
Wafer Surface
22%
Feature Extraction
22%
Integrated Circuits
22%
Automatic Optical Inspection
22%
High Density
22%
Future Roadmap
22%
Parametrized Quantum Circuit
22%
Circuit-based
22%
Machine Learning Techniques
16%
Classification Problem
16%
Semiconductors
16%
Internet of Things
16%
Feature Map
16%
Classification Task
15%
Product Quality
11%
Quantum Layer
11%
Quantum Hybrid
11%
Map Classification
11%
Quantum Machine Learning
11%
Engineering
Deep Learning Method
100%
Defect Classification
97%
Convolutional Neural Network
66%
Defect Detection
33%
Feature Extraction
33%
Genetic Algorithm
33%
Preventive Maintenance
33%
Semiconductor Manufacturing
33%
Classification Task
33%
False Negative
33%
Isolation Method
33%
Internet-Of-Things
33%
Quantum Circuit
22%
Classification Performance
18%
Primary Task
16%
Feedback Information
16%
Linear Transformation
16%
Quality Issue
16%
Product Yield
16%
Manufacturing Company
16%
Integrated Circuit
13%
Machine Learning Technique
12%
Product Quality
11%
Quantum Computation
11%
Artificial Intelligence
11%
Classification Problem
6%
Semiconducting Material
6%
Scanning Electron Microscope
6%
Surface Defect
6%
Recognition Accuracy
6%
Pattern Recognition
6%
Individual Component
6%
Process Step
6%
Final Result
5%
Mask Pattern
5%
Inspection Technology
5%
Learning System
5%
Classification Accuracy
5%
Test Dataset
5%
Support Vector Machine
5%
Main Purpose
5%
Step Approach
5%
Customer Expectation
5%
Experimental Result
5%
Process Flow
5%
Electronic Product
5%
Maintenance Planning
5%
Component Model
5%
Single Component
5%