李 育民

Engineering & Materials Science

1. Hot Temperature 100%
2. Simulators 95%
3. Electric power systems 76%
4. Thermoanalysis 66%
5. Wire 46%
6. Smartphones 37%
7. Electric lines 33%
8. Placers 33%
9. Timing circuits 31%
10. Data storage equipment 31%
11. Engines 29%
12. Temperature 29%
13. Computer simulation 27%
14. Temperature distribution 27%
15. Silicon 25%
16. Integrated circuit design 24%
17. Electric power utilization 23%
18. Heat pipes 22%
19. Thermal effects 22%
20. Clocks 22%
21. Equivalent circuits 22%
22. Networks (circuits) 21%
23. Transistors 20%
24. Electric network analysis 20%
25. Markov chains 19%
26. Capacitance 17%
27. Electric potential 16%
28. VLSI circuits 15%
29. Monte Carlo methods 14%
30. Polynomials 14%
31. Circuit simulation 14%
32. Automobile electronic equipment 13%
33. Passive networks 13%
34. Mesh generation 12%
35. SPICE 11%
36. Bins 11%
37. Electric wiring 10%
38. Sleep 10%
39. Topology 10%
40. Three dimensional integrated circuits 10%
41. Electric power distribution 9%
42. Green's function 9%
43. Deep neural networks 9%
44. Relaxation 9%
45. Cooling 9%
46. Linear systems 9%
47. Packaging 9%
48. Deep learning 9%
49. Sensitivity analysis 8%
50. Agglomeration 8%