個人檔案
研究專長
VLSI設計自動化
經歷
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
教育/學術資格
PhD, 電機與電腦工程, University of Wisconsin-Madison
外部位置
指紋
查看啟用 Yu-Min Lee 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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過去五年中的合作和熱門研究領域
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專案
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MErBAG: Mesh Error Based Adaptive Grid Generation in System-Level Thermal Analysis
Lee, Y. M., Hsu, S. C., Tsai, B. Y. & Lu, Z. L., 2025, Proceedings of the 26th International Symposium on Quality Electronic Design, ISQED 2025. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).研究成果: Conference contribution › 同行評審
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Thermal Model Extraction at Chip Boundaries for Thermal Simulation of Chip in a System
Lin, K. X., Lee, Y. M. & Tsai, B. Y., 2025, Proceedings of the 26th International Symposium on Quality Electronic Design, ISQED 2025. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).研究成果: Conference contribution › 同行評審
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Therunet-SP: 2.5D IC Thermal Simulation Using U-Net Convolution and Scaling Procedure
Lee, Y. M., Huang, S. P. & Lin, Y. H., 2025, Proceedings of the 26th International Symposium on Quality Electronic Design, ISQED 2025. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).研究成果: Conference contribution › 同行評審
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SpotLight: A Hotspot-Greedy, Light-Weighted, and Automated Thermal Modeling Framework for Early Smartphone Design
Wu, C. W., Lee, Y. M., Huang, P. Y., Yang, B. J., Chen, T. Y., Huang, T. C. & Lee, Y. L., 2024, Proceedings of the 25th International Symposium on Quality Electronic Design, ISQED 2024. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).研究成果: Conference contribution › 同行評審
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Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration
Chiou, H. W., Jiang, J. H., Chang, Y. T., Lee, Y. M. & Pan, C. W., 16 1月 2023, ASP-DAC 2023 - 28th Asia and South Pacific Design Automation Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 7-12 6 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).研究成果: Conference contribution › 同行評審
13 引文 斯高帕斯（Scopus）