每年專案
個人檔案
研究專長
VLSI設計自動化
經歷
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
教育/學術資格
PhD, 電機與電腦工程, University of Wisconsin-Madison
外部位置
指紋
查看啟用 Yu-Min Lee 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
專案
- 14 已完成
-
SpotLight: A Hotspot-Greedy, Light-Weighted, and Automated Thermal Modeling Framework for Early Smartphone Design
Wu, C. W., Lee, Y. M., Huang, P. Y., Yang, B. J., Chen, T. Y., Huang, T. C. & Lee, Y. L., 2024, Proceedings of the 25th International Symposium on Quality Electronic Design, ISQED 2024. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).研究成果: Conference contribution › 同行評審
-
Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration
Chiou, H. W., Jiang, J. H., Chang, Y. T., Lee, Y. M. & Pan, C. W., 16 1月 2023, ASP-DAC 2023 - 28th Asia and South Pacific Design Automation Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 7-12 6 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).研究成果: Conference contribution › 同行評審
3 引文 斯高帕斯（Scopus） -
Phone-nomenon 2.0: A compact thermal model for smartphones
Lee, Y. M., Chiou, H. W., Shiau, S., Pan, C. W. & Ting, S. H., 2023, (Accepted/In press) 於: IET Computers and Digital Techniques.研究成果: Article › 同行評審
開啟存取3 引文 斯高帕斯（Scopus） -
An Approximated Model of Boltzmann Transport Equation for Nano-Scale Thermal Analysis
Chang, C. C., Chiou, H. W. & Lee, Y. M., 2022, Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2022-May).研究成果: Conference contribution › 同行評審
-
DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis
Lo, W. S., Chiou, H. W., Hsu, S. C. & Lee, Y. M., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 477-483 7 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2021-June).研究成果: Conference contribution › 同行評審