每年專案
個人檔案
研究專長
VLSI設計自動化
經歷
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
教育/學術資格
PhD, 電機與電腦工程, University of Wisconsin-Madison
外部位置
指紋
查看啟用 Yu-Min Lee 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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Phone-nomenon 2.0: A compact thermal model for smartphones
Lee, Y. M., Chiou, H. W., Shiau, S., Pan, C. W. & Ting, S. H., 2023, (Accepted/In press) 於: IET Computers and Digital Techniques.研究成果: Article › 同行評審
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An Approximated Model of Boltzmann Transport Equation for Nano-Scale Thermal Analysis
Chang, C. C., Chiou, H. W. & Lee, Y. M., 2022, Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2022-May).研究成果: Conference contribution › 同行評審
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DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis
Lo, W. S., Chiou, H. W., Hsu, S. C. & Lee, Y. M., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 477-483 7 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; 卷 2021-June).研究成果: Conference contribution › 同行評審
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Thermal Pad Design Flow for Automotive Electronics
Chen, G. J., Chiou, H. W., Chang, Y. T. & Lee, Y. M., 2021, 2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021).研究成果: Conference contribution › 同行評審
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A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, M. Y., Chen, H-M., Chen, K-N., Wu, S. H., Lee, Y-M. & Su, A. Y., 6月 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; 卷 2020-June).研究成果: Conference contribution › 同行評審