每年研究成果
每年研究成果
- 6結果
搜尋結果
-
2009
Improved MILC poly-Si TFTs performance using CF4 plasma
Chang, C. P. & Wu, Y-C., 1 12月 2009.研究成果: Paper › 同行評審
-
2005
Effects of in- And anti-phase bonding and type of dopant on the microstructures of nano-scaled interface and electrical properties of N/P-type GaAs wafers (at and below 600°C)
Cheng, J. H., Ouyang, H., Lu, C. L., Wu, Y-C. & Chiou, S. H., 5月 2005, p. 393-398. 6 p.研究成果: Paper › 同行評審
-
Effects of interfacial native oxide on electrical properties of bonded GaAs wafers
Liu, P. C., Lu, C. L., Peng, W. C., Wu, Y-C. & Ouyang, H., 5月 2005, p. 374-382. 9 p.研究成果: Paper › 同行評審
-
2004
Effects of nano-sized interface on the electrical resistances of the P-GaAs wafer bonding
Ouyang, H., Cheng, J. H. & Wu, Y-C., 1 12月 2004, p. 60-64. 5 p.研究成果: Paper › 同行評審
-
2003
AlGaInP light-emitting diodes with metal substrate fabricated by wafer bonding
Peng, W. C. & Wu, Y-C., 1 12月 2003, p. 144-153. 10 p.研究成果: Paper › 同行評審
-
Wafer bonding using indium tin oxide intermediate layer for high brightness leds
Liu, P. C., Hou, C. Y. & Wu, Y-C., 1 12月 2003, p. 175-183. 9 p.研究成果: Paper › 同行評審