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查看斯高帕斯 (Scopus) 概要
鄭 文雅
副教授
機械工程學系
https://orcid.org/0000-0002-6292-5100
電話
03-5712121#55113
電子郵件
wyjang
nycu.edu
tw
h-index
h10-index
h5-index
1493
引文
10
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
192
引文
5
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
8
引文
1
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
2005
2024
每年研究成果
概覽
指紋
網路
計畫
(7)
研究成果
(22)
類似的個人檔案
(5)
指紋
查看啟用 Wen-Yea Jang 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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重量
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Keyphrases
Open-cell Foam
92%
Ligament
82%
Mechanical Properties
77%
Compressive Response
71%
Elastic Properties
70%
Cell Size
57%
Kelvin Cell
50%
Microstructure
48%
Cascode
47%
Relative Density
42%
Closed-cell Aluminum Foam
40%
Numerical Model
40%
Power Module
40%
Power Electronics Applications
40%
Wafer
40%
Limit Load
37%
Elastic Modulus
37%
Periodic Domain
37%
Closed-cell Foam
35%
Finite Element Model
35%
Microstructure Properties
33%
Monodisperse
33%
Collapse Stress
30%
Hexagonal Honeycomb
30%
Rdson
27%
Switching Condition
27%
On-state Resistance
27%
Area Distribution
25%
Cross-sectional Area
25%
Off-state
23%
Polyhedron
22%
Elastic Regime
21%
Random Dispersion
20%
Large Diameter pipe
20%
Collapse Resistance
20%
Flake Particles
20%
Microstructure Characterization
20%
Control Engineering
20%
Solid Mechanics
20%
Size Dispersity
20%
Random Cell
20%
Open-cell Metal Foam
20%
Buckling Stress
20%
Argon Plasma Jet
20%
Nanoengineering
20%
Multi-chip
20%
Foam Scaffolds
20%
Honeycomb Panel
20%
Laterally Loaded
20%
GaN MIS-HEMT
20%
Engineering
Foam Cell
100%
Closed Cell
60%
Experimental Result
58%
Finite Element Modeling
50%
Load Limits
43%
Power Electronics
40%
Numerical Model
40%
Engineering
40%
Double Wall
40%
Modulus of Elasticity
40%
Base Material
37%
Elastic Regime
33%
Shell Element
27%
Extended Defect
23%
Cold Expansion
23%
Residual Stress
23%
Pulse Test
20%
Dynamic Stability
20%
Solid Mechanics
20%
Control Engineering
20%
Gate Bias
20%
Buffer Layer
20%
Pressure Plasma
20%
Solid Foam
20%
Stability Analysis
20%
Nitride
20%
Cross Section
20%
Process Chamber
20%
Chamber Pressure
20%
Atmospheric Pressure
20%
Buckling Stress
20%
Nonlinear Behavior
20%
Finite Element Analysis
20%
Fine Mesh
20%
Process Result
20%
Diameter Pipe
20%
Collapse Pressure
20%
Compressive Strength
20%
Compression Strength
20%
Stress Limit
20%
Metal Foam
20%
Power Supply
20%
Dielectric Layer
20%
Production Line
20%
Electric Stress
20%
Anisotropic
17%
Displacement Response
16%
Stress Level
16%
Young's Modulus
13%
Face-Centered Cubic
13%