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查看斯高帕斯 (Scopus) 概要
徐 文祥
教授
機械工程學系
https://orcid.org/0000-0002-0189-9578
電話
03-5712121#55111
電子郵件
whsu
nycu.edu
tw
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https://sites.google.com/site/whsulab/
h-index
h10-index
h5-index
1393
引文
17
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
527
引文
10
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
46
引文
3
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1992 …
2022
每年研究成果
概覽
指紋
網路
計畫
(40)
研究成果
(173)
類似的個人檔案
(6)
如果您對這些純文本內容做了任何改變，很快就會看到。
指紋
查看啟用 Wen-Syang Hsu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
Actuators
55%
Assays
19%
Bone
15%
Cams
17%
Cantilever beams
34%
Carbon nanotubes
17%
Contact resistance
21%
Diamonds
33%
Digital microfluidics
88%
Electric potential
33%
Electrodes
20%
Electrophoresis
19%
Electroplating
31%
Etching
46%
Fabrication
100%
Fluorescence
26%
Friction
16%
Glass
18%
Hot Temperature
36%
Hydraulics
16%
Inductively coupled plasma
17%
Magnets
17%
Masks
21%
Membranes
32%
MEMS
60%
Microactuators
94%
Microfluidics
44%
Microstructure
47%
Mirrors
25%
Nails
50%
Nanocomposites
53%
Natural frequencies
23%
Networks (circuits)
16%
Nickel
37%
Photoresists
50%
Polymers
29%
Polysilicon
38%
Reactive ion etching
26%
Resistance welding
26%
Sensors
17%
Silicon
41%
Stiction
21%
Strain gages
29%
Substrates
42%
Surface roughness
27%
Surgery
28%
Switches
19%
Temperature
23%
Testing
18%
Thermal expansion
18%
Physics & Astronomy
actuation
8%
actuators
14%
augmentation
14%
beads
21%
bones
9%
cantilever beams
12%
capacitors
9%
carbon nanotubes
8%
characterization
8%
chips
28%
coils
10%
culture media
14%
deflection
12%
diamonds
10%
electric potential
10%
electroplating
28%
embryos
31%
etching
16%
fabrication
44%
glass
10%
immunoassay
21%
inductors
19%
latches
9%
LC circuits
23%
lithography
9%
locking
10%
manufacturing
15%
microelectromechanical systems
26%
microelectronics
10%
microstructure
15%
milk
11%
mirrors
9%
modules
12%
nanocomposites
22%
nickel
9%
optical disks
12%
performance
8%
photoresists
32%
platforms
10%
polymers
10%
radio frequencies
8%
recorders
12%
resonant frequencies
11%
screws
12%
sensors
24%
silicon
12%
stiction
12%
surface roughness
9%
surgery
11%
switches
10%
Chemical Compounds
Adhesive Bonding
10%
Application
12%
Behavior as Electrode
8%
Cantilever Beam
28%
Capacitor
7%
Coil
14%
Contact Resistance
8%
Culture Media
10%
Dew Point
7%
Diamond
7%
Dimension
9%
Displacement
51%
Electrical Conductivity
7%
Electrodeposition
24%
Environment
7%
Epitaxial Film
9%
Epitaxial Growth
7%
Etching
36%
Force
20%
Glass Substrate
9%
Immunoassay
16%
Inductance
8%
Inductor
23%
Intramedullary
9%
Length
12%
Liquid
9%
Liquid Film
8%
Machining
8%
Metal
11%
Microelectronics
11%
Micromachining
29%
Microstructure
23%
Modification
9%
Nanocomposite
19%
Nanotube
8%
Plate Like Crystal
15%
Residual Stress
11%
Resistance
7%
Simulation
26%
Soldering
7%
Sputtering
8%
Strain
8%
Strength
9%
Surface
21%
Surface Roughness
7%
Thermal Expansion
15%
Thermal Expansion Coefficient
8%
Time
15%
Vibrator
8%
Voltage
36%
