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查看斯高帕斯 (Scopus) 概要
徐 文祥
教授
機械工程學系
https://orcid.org/0000-0002-0189-9578
電話
03-5712121#55111
電子郵件
whsu
nycu.edu
tw
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https://sites.google.com/site/whsulab/
h-index
h10-index
h5-index
1086
引文
16
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
509
引文
10
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
40
引文
3
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1992 …
2022
每年研究成果
概覽
指紋
網路
計畫
(40)
研究成果
(173)
類似的個人檔案
(6)
如果您對這些純文本內容做了任何改變，很快就會看到。
指紋
查看啟用 Wen-Syang Hsu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
Fabrication
100%
Microactuators
94%
Digital microfluidics
88%
MEMS
60%
Actuators
55%
Nanocomposites
53%
Nails
50%
Photoresists
50%
Microstructure
47%
Etching
46%
Microfluidics
44%
Substrates
42%
Silicon
41%
Polysilicon
38%
Nickel
37%
Hot Temperature
36%
Cantilever beams
34%
Electric potential
33%
Diamonds
33%
Membranes
32%
Electroplating
31%
Polymers
29%
Strain gages
29%
Surgery
28%
Surface roughness
27%
Fluorescence
26%
Reactive ion etching
26%
Resistance welding
26%
Mirrors
25%
Temperature
23%
Natural frequencies
23%
Masks
21%
Stiction
21%
Contact resistance
21%
Electrodes
20%
Electrophoresis
19%
Switches
19%
Assays
19%
Thermal expansion
18%
Testing
18%
Glass
18%
Carbon nanotubes
17%
Cams
17%
Magnets
17%
Sensors
17%
Inductively coupled plasma
17%
Hydraulics
16%
Networks (circuits)
16%
Friction
16%
Bone
15%
Physics & Astronomy
fabrication
44%
photoresists
32%
embryos
31%
chips
28%
electroplating
28%
microelectromechanical systems
26%
sensors
24%
LC circuits
23%
nanocomposites
22%
beads
21%
immunoassay
21%
inductors
19%
etching
16%
manufacturing
15%
microstructure
15%
augmentation
14%
actuators
14%
culture media
14%
screws
12%
cantilever beams
12%
recorders
12%
modules
12%
stiction
12%
optical disks
12%
deflection
12%
silicon
12%
milk
11%
surgery
11%
resonant frequencies
11%
diamonds
10%
locking
10%
polymers
10%
coils
10%
electric potential
10%
switches
10%
microelectronics
10%
platforms
10%
glass
10%
capacitors
9%
surface roughness
9%
mirrors
9%
latches
9%
nickel
9%
lithography
9%
bones
9%
performance
8%
actuation
8%
carbon nanotubes
8%
radio frequencies
8%
characterization
8%
Chemical Compounds
Displacement
51%
Etching
36%
Voltage
36%
Micromachining
29%
Cantilever Beam
28%
Simulation
26%
Electrodeposition
24%
Microstructure
23%
Inductor
23%
Surface
21%
Force
20%
Nanocomposite
19%
Immunoassay
16%
Time
15%
Plate Like Crystal
15%
Thermal Expansion
15%
Coil
14%
Application
12%
Length
12%
Residual Stress
11%
Metal
11%
Microelectronics
11%
Culture Media
10%
Adhesive Bonding
10%
Modification
9%
Strength
9%
Dimension
9%
Intramedullary
9%
Glass Substrate
9%
Liquid
9%
Epitaxial Film
9%
Strain
8%
Thermal Expansion Coefficient
8%
Inductance
8%
Machining
8%
Contact Resistance
8%
Vibrator
8%
Liquid Film
8%
Sputtering
8%
Behavior as Electrode
8%
Nanotube
8%
Electrical Conductivity
7%
Capacitor
7%
Epitaxial Growth
7%
Surface Roughness
7%
Environment
7%
Dew Point
7%
Diamond
7%
Resistance
7%
Soldering
7%
