跳至主導覽
跳至搜尋
跳過主要內容
國立陽明交通大學研發優勢分析平台 首頁
English
中文
首頁
人員
單位
研究成果
計畫
獎項
活動
貴重儀器
影響
按專業知識、姓名或所屬機構搜尋
查看斯高帕斯 (Scopus) 概要
徐 文祥
教授
機械工程學系
https://orcid.org/0000-0002-0189-9578
電話
03-5712121#55111
電子郵件
whsu
nycu.edu
tw
網站
https://sites.google.com/site/whsulab/
h-index
h10-index
h5-index
1517
引文
18
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
601
引文
12
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
77
引文
5
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1992 …
2024
每年研究成果
概覽
指紋
網路
計畫
(40)
研究成果
(177)
類似的個人檔案
(6)
指紋
查看啟用 Wen-Syang Hsu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Keyphrases
Microactuators
67%
Digital Microfluidics
65%
Microstructure
53%
Thermally Driven
44%
Photoresist
41%
Three-dimensional (3D)
39%
Polysilicon
39%
Electroplating
38%
Screw Hole
37%
Bead-based
37%
Ni-diamond
36%
Electrothermal Microactuator
35%
Adjuster
35%
Intramedullary Nail
34%
Electrowetting
32%
Partial Exposure
32%
Resonant Frequency
31%
Etching Process
29%
Microdrive
29%
Double-sided
27%
Hydraulics
26%
Damper
26%
Actuator
25%
SU-8
25%
Inductors
25%
Electrowetting-on-Dielectric (EWoD)
24%
Exposure Method
24%
Limit of Detection
24%
Fabrication Methods
23%
LC Circuit
23%
Micro Resistance Welding
23%
Dielectrophoresis
23%
Nail Surgery
23%
Interleukin-1β
23%
Microfluidics
23%
Electrothermal Actuator
23%
Targeting Mechanism
22%
Microfluidic Immunoassay
21%
Shock Switch
21%
Output Displacement
21%
Strain Sensor
21%
Microassembly
20%
Digital Microfluidic chip
20%
Passive Wireless Sensor
20%
Mechanical Latch
20%
Micromechanics
19%
Input Voltage
19%
Magnetic Beads
19%
Interlocking Nail
19%
Carbon Nanotube Nanocomposites
19%
Engineering
Actuator
100%
Experimental Result
73%
Digital Microfluidics
65%
Microelectromechanical System
59%
Photoresist
56%
Resonant Frequency
48%
Nanocomposite
46%
Actuation
39%
Polysilicon
39%
Diamond
33%
Cantilever Beam
33%
Input Voltage
33%
Microchannel
32%
Low-Temperature
29%
Simulation Result
29%
Hydraulics
29%
Back Side
28%
Magnetic Flux
27%
Dielectrics
27%
Finite Element Analysis
24%
Good Agreement
24%
Design Parameter
23%
Etching Process
23%
Resistance Welding
23%
Dynamic Response
22%
Analytical Model
22%
Silicon Dioxide
21%
Glass Substrate
21%
Front Side
20%
Automotives
20%
Voltage Driving
19%
Output Force
18%
Contact Force
17%
Computer Aided Manufacturing
17%
Experimental Investigation
16%
Microstructure
16%
Cross Section
16%
Lithography
16%
Electric Field
16%
Nitride
15%
Simulated Result
15%
Computational Fluid Dynamics
14%
Friction Force
14%
Inductively Coupled Plasma
14%
Rigidity
14%
Displacement Relation
14%
Insertion Loss
13%
Fabrication Method
13%
Conductive
13%
Lateral Displacement
13%
