每年研究成果
每年研究成果
- 4結果
搜尋結果
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2023
A CMOS Buffer Amplifier with Slew-Rate Enhancement and Power Saving Techniques
Lu, L. J., Chu, P. H., Huang, W. C. & Liao, Y. T., 2023, 2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2023 International VLSI Symposium on Technology, Systems and Applications, VLSI-TSA/VLSI-DAT 2023 - Proceedings).研究成果: Conference contribution › 同行評審
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An Ultrathin and Adhesive Skin-Compliant Electrode Patch combined with a Portable Multi-Channel EEG Acquisition System
Huang, W. H., Lin, C. C., Huang, W. C. & Chiueh, H., 2023, BioCAS 2023 - 2023 IEEE Biomedical Circuits and Systems Conference, Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., (BioCAS 2023 - 2023 IEEE Biomedical Circuits and Systems Conference, Conference Proceedings).研究成果: Conference contribution › 同行評審
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Fabrication of Biodegradable Soft Tissue-Mimicked Microelectrode Arrays for Implanted Neural Interfacing
Huang, W. C., Lei, W. L. & Peng, C. W., 2023, 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc., p. 392-395 4 p. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2023-January).研究成果: Conference contribution › 同行評審
1 引文 斯高帕斯（Scopus） -
2018
Ultra-compliant peripheral nerve cuff electrode with hydrogel adhesion
Ong, X. C., Huang, W.-C., Kwon, I. S., Gopinath, C., Wu, H., Fisher, L. E., Gaunt, R. A., Bettinger, C. J. & Fedder, G. K., 24 4月 2018, 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Institute of Electrical and Electronics Engineers Inc., p. 376-379 4 p. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2018-January).研究成果: Conference contribution › 同行評審
5 引文 斯高帕斯（Scopus）