每年專案
個人檔案
研究專長
半導體元件可靠性、快閃式記憶元件、高速元件與電路
經歷
1987/08 國立交通大學電子工程學系電子研究所教授
教育/學術資格
PhD, University of Illinois at Urbana-Champaign
外部位置
指紋
查看啟用 Ta-Hui Wang 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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網路
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料,或
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電阻式記憶體SET/RESET循環操作後資料儲存時間退化與加速測試方法及其理論與統計模式
1/08/20 → 31/10/21
研究計畫: Ministry of Science and Technology
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電阻式記憶體SET/RESET循環操作後資料儲存時間退化與加速測試方法及其理論與統計模式
1/08/19 → 31/10/20
研究計畫: Ministry of Science and Technology
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An Analytical Model of Read-Disturb Failure Time in a Post-Cycling Resistive Switching Memory
Jiang, C. M., Wang, C. C., Li, K. S., Lin, C. C. & Wang, T., 2021, (Accepted/In press) 於: IEEE Transactions on Device and Materials Reliability.研究成果: Article › 同行評審
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Investigation of Vth Distribution Tails of Ground-Select-Line Cells and Edge Dummy Cells in a 3-D NAND Flash Memory
Chou, Y. L., Wang, T., Cheng, C. C., Lu, C. C., Wu, G. W., Ku, S. H., Chang, W., Tsai, W. J., Lu, T. C., Chen, K. C. & Lu, C. Y., 5月 2021, 於: IEEE Transactions on Electron Devices. 68, 5, p. 2260 - 2264 5 p.研究成果: Article › 同行評審
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Analytical Modeling of Read-Induced SET-State Conductance Change in a Hafnium-Oxide Resistive Switching Device
Su, P. C., Jiang, C. M., Chen, Y. J., Wang, C. C., Li, K. S., Lin, C. C. & Wang, T., 1月 2020, 於: IEEE Transactions on Electron Devices. 67, 1, p. 113-117 5 p., 8935500.研究成果: Article › 同行評審
1 引文 斯高帕斯(Scopus) -
Design Space Analysis for Cross-Point 1S1MTJ MRAM: Selector-MTJ Cooptimization
Chiang, H. L., Chen, T. C., Song, M. Y., Chen, Y. S., Chiu, J. P., Chiang, K., Manfrini, M., Cai, J., Gallagher, W. J., Wang, T., Diaz, C. H. & Wong, H. S. P., 8月 2020, 於: IEEE Transactions on Electron Devices. 67, 8, p. 3102-3108 7 p., 9139332.研究成果: Article › 同行評審
2 引文 斯高帕斯(Scopus) -
Analysis and Realization of TLC or even QLC Operation with a High Performance Multi-times Verify Scheme in 3D NAND Flash memory
Lu, C. C., Cheng, C. C., Chiu, H. P., Lin, W. L., Chen, T. W., Ku, S. H., Tsai, W. J., Lu, T. C., Chen, K. C., Wang, T-H. & Lu, C. Y., 16 1月 2019, 2018 IEEE International Electron Devices Meeting, IEDM 2018. Institute of Electrical and Electronics Engineers Inc., p. 2.2.1-2.2.4 8614548. (Technical Digest - International Electron Devices Meeting, IEDM; 卷 2018-December).研究成果: Conference contribution › 同行評審
3 引文 斯高帕斯(Scopus)