Seiji Samukawa

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263 Article
76 Conference contribution
14 Conference article
8 Chapter
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8結果

篩選

2021
Damage-free neutral beam etching for GaN micro-LEDs processing
Wang, X. & Samukawa, S., 1月 2021, Micro LEDs. Jiang, H. & Lin, J. (編輯). Academic Press Inc., p. 203-221 19 p. (Semiconductors and Semimetals; 卷 106).
研究成果: Chapter › 同行評審
2017
Fabrication of threedimensional Si quantum dot array by fusion of biotemplate and neutral beam etching
Samukawa, S., 1 1月 2017, Silicon Nanomaterials Sourcebook: Volume II: Hybrid Materials, Arrays, Networks, and Devices. CRC Press, p. 87-105 19 p.
研究成果: Chapter › 同行評審
2016
Fabrication of 3D quantum dot array by fusion of bio-template and neutral beam etching I: Basic technologies
Samukawa, S., 1 1月 2016, Intelligent Nanosystems for Energy, Information and Biological Technologies. Springer Japan, p. 145-167 23 p.
研究成果: Chapter › 同行評審
Fabrication of 3D quantum dot array by fusion of biotemplate and neutral beam etching II: Application to QD solar cells and laser/LED
Samukawa, S., 1 1月 2016, Intelligent Nanosystems for Energy, Information and Biological Technologies. Springer Japan, p. 169-192 24 p.
研究成果: Chapter › 同行評審
1 引文斯高帕斯（Scopus）
2014
Etching Gas
Samukawa, S., 24 11月 2014, Iodine Chemistry and Applications. Wiley-Blackwell, 卷 9781118466292. p. 523-545 23 p.
研究成果: Chapter › 同行評審
Feature profile evolution in plasma processing using wireless on-wafer monitoring system
Samukawa, S., 2014, SpringerBriefs in Applied Sciences and Technology. Springer Verlag, p. 33-38 6 p. (SpringerBriefs in Applied Sciences and Technology; 卷 102).
研究成果: Chapter › 同行評審
1 引文斯高帕斯（Scopus）
On-wafer UV sensor and prediction of UV irradiation damage
Samukawa, S., 2014, SpringerBriefs in Applied Sciences and Technology. Springer Verlag, p. 5-18 14 p. (SpringerBriefs in Applied Sciences and Technology; 卷 102).
研究成果: Chapter › 同行評審
Prediction of abnormal etching profiles in high-aspect-ratio via/hole etching using on-wafer monitoring system
Samukawa, S., 2014, SpringerBriefs in Applied Sciences and Technology. Springer Verlag, p. 19-31 13 p. (SpringerBriefs in Applied Sciences and Technology; 卷 102).
研究成果: Chapter › 同行評審

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