每年專案
個人檔案
研究專長
3D繪圖系統與晶片設計、低功率/高效能DSP設計、物聯網系統與應用
經歷
1. Associate Professor, Dept. of Computer Science, NCTU, 2011-present
2. Assistance Professor, Dept. of Computer Science, NCTU, 2006-2011
3. Deputy Department Manager, National Chip Implementation Center (CIC), 2004-2006
4. Associate Researcher, National Chip Implementation Center (CIC), 2001-2006
教育/學術資格
PhD, 電機工程, National Taiwan University
外部位置
指紋
查看啟用 Lan-Da Van 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
網路
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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支援未來AR/VR應用的高效能繪圖系統技術-子計畫三:可調式低功耗雲端三維繪圖渲染器架構與系統設計
1/08/19 → 31/07/20
研究計畫: Other Government Ministry Institute
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Accuracy-Time Efficient Hyperparameter Optimization Using Actor-Critic-based Reinforcement Learning and Early Stopping in OpenAI Gym Environment
Christian, A. B., Lin, C. Y., Tseng, Y. C., Van, L. D., Hu, W. H. & Yu, C. H., 2022, Proceedings of the 2022 IEEE International Conference on Internet of Things and Intelligence Systems, IoTaIS 2022. Institute of Electrical and Electronics Engineers Inc., p. 230-234 5 p. (Proceedings of the 2022 IEEE International Conference on Internet of Things and Intelligence Systems, IoTaIS 2022).研究成果: Conference contribution › 同行評審
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A Skeleton-based View-Invariant Framework for Human Fall Detection in an Elevator
Ali, R., Hutomo, I. S., Van, L. D. & Tseng, Y. C., 2022, 2022 IEEE International Conference on Industrial Technology, ICIT 2022. Institute of Electrical and Electronics Engineers Inc., (Proceedings of the IEEE International Conference on Industrial Technology; 卷 2022-August).研究成果: Conference contribution › 同行評審
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Person Tracking by Fusing Posture Data from UAV Video and Wearable Sensors
Mukashev, A., Van, L. D., Sharma, S., Farhan Tandia, M. & Tseng, Y. C., 2022, (Accepted/In press) 於: IEEE Sensors Journal. p. 1 1 p.研究成果: Article › 同行評審
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Radar and Camera Fusion for Object Forecasting in Driving Scenarios
Christian, A. B., Wu, Y. H., Lin, C. Y., Van, L. D. & Tseng, Y. C., 2022, Proceedings - 2022 IEEE 15th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2022. Institute of Electrical and Electronics Engineers Inc., p. 105-111 7 p. (Proceedings - 2022 IEEE 15th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2022).研究成果: Conference contribution › 同行評審
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A Computation-Aware TPL Utilization Procedure for Parallelizing the FastICA Algorithm on a Multi-Core CPU
Van, L. D., Wang, T. J., Tzeng, S. J. & Jung, T. P., 2021, Proceedings - 2021 IEEE 14th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2021. Institute of Electrical and Electronics Engineers Inc., p. 171-177 7 p. (Proceedings - 2021 IEEE 14th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2021).研究成果: Conference contribution › 同行評審
獎品
活動
- 2 Editorial work
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IEEE TRANSACTIONS ON COMPUTERS (事件)
Lan-Da Van (Member of editorial board)
16 10月 2014 → 15 10月 2018活動: Editorial work