每年研究成果
每年研究成果
搜尋結果
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2024
Direct copper interconnection for die/wafer bonding: Overview
Hung, T. H. & Chen, K. N., 28 6月 2024, Direct Copper Interconnection for Advanced Semiconductor Technology. CRC Press, p. 19-53 35 p.研究成果: Chapter › 同行評審
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2016
3D integration technology-introduction and overview
Tan, C. S., Koester, S. J. & Chen, K. N., 19 4月 2016, 3D Integration for VLSI Systems. Pan Stanford Publishing Pte. Ltd., p. 2-26 25 p.研究成果 › 同行評審
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2012
Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers
Chen, K.-N. & Tan, C. S., 8 2月 2012, Handbook of Wafer Bonding. Wiley-VCH, p. 161-180 20 p.研究成果 › 同行評審
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2011
3D integration technology - Introduction and overview
Tan, C. S., Koester, S. J. & Chen, K.-N., 30 9月 2011, 3D Integration for VLSI Systems. Pan Stanford Publishing Pte. Ltd., p. 1-26 26 p.研究成果 › 同行評審