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查看斯高帕斯 (Scopus) 概要
陳 冠能
教授
電子研究所
智慧半導體奈米系統技術研究中心
https://orcid.org/0000-0003-4316-0007
h-index
h10-index
h5-index
4687
引文
37
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
1601
引文
19
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
511
引文
13
h-指數
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2001
2024
每年研究成果
概覽
指紋
網路
計畫
(30)
研究成果
(281)
獎項
(7)
活動
(1)
類似的個人檔案
(6)
指紋
查看啟用 Kuan-Neng Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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Keyphrases
3D Heterogeneous Integration
10%
3D IC
46%
3D Integration
100%
Advanced Packaging
11%
Back-end-of-line
9%
Bonding Interface
12%
Bonding Process
23%
Bonding Quality
24%
Bonding Structure
25%
Bonding Technology
34%
Bonding Temperature
24%
Buffer Layer
13%
Chip-level
12%
Copper Wafer
13%
Cu TSV
11%
Cu-Cu Bonding
52%
Cu-Sn
25%
Electrical Characteristics
12%
Electrical Performance
28%
Electrical Reliability
14%
Fan-out
14%
Fin Field-effect Transistor (FinFET)
10%
Fine pitch
14%
Heterogeneous Integration
32%
Hybrid Bonding
50%
In(III)
13%
Integrated Application
26%
Integration Scheme
25%
Interposer
9%
Low Temperature
73%
Low Thermal Budget
11%
Low-temperature Bonding
18%
Microbump
16%
Microsystems
17%
Neural Sensing
21%
Oxides
11%
Passivation
18%
Passivation Layer
20%
Polyimide
11%
Redistribution Layer
11%
Reliability Test
11%
Sensing Applications
10%
Thermo-compression Bonding
10%
Three-dimensional Integration
36%
Through Silicon via
49%
Ultrathin
14%
Wafer
25%
Wafer Bonding
29%
Wafer Level
44%
Wafer-level Packaging
9%
Engineering
Adhesion Layer
5%
Bond Strength
7%
Bonded Structure
9%
Bonding Material
7%
Bonding Mechanism
5%
Bonding Process
22%
Bonding Strength
12%
Bonding Structure
18%
Bonding Technology
45%
Bonding Temperature
26%
Buffer Layer
8%
Copper Wafer
13%
Creep
5%
Cu Surface
7%
Dielectrics
12%
Direct Bonding
25%
Electrical Measurement
10%
Electrical Performance
37%
Eutectic Bonding
6%
Fits and Tolerances
6%
Humidity Test
5%
Integrated Circuit
6%
Integration Platform
7%
Interconnects
47%
Interposer
21%
Joints (Structural Components)
8%
Level Packaging
13%
Low-Temperature
93%
Manufacturability
7%
Metal Layer
8%
Microelectromechanical System
8%
Microsystem
19%
Nodes
5%
Passivation
31%
Passivation Layer
21%
Process Development
5%
Process Flow
6%
Realization
6%
Reliability Analysis
16%
Reliability Assessment
7%
Sensing Application
10%
Silicon Dioxide
12%
Silicon Layer
8%
Silicon Substrate
8%
Technology Integration
16%
Thermal Stress
5%
Thermocompression Bonding
5%
Thin Films
11%
Three Dimensional Integrated Circuits
32%
Wafer Bonding
41%