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查看斯高帕斯 (Scopus) 概要
陳 冠能
教授
電子研究所
智慧半導體奈米系統技術研究中心
https://orcid.org/0000-0003-4316-0007
h-index
h10-index
h5-index
4662
引文
37
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1583
引文
19
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
502
引文
13
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
2001
2024
每年研究成果
概覽
指紋
網路
計畫
(30)
研究成果
(281)
獎項
(7)
活動
(1)
類似的個人檔案
(6)
指紋
查看啟用 Kuan-Neng Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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重量
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Keyphrases
3D Integration
100%
Low Temperature
73%
Cu-Cu Bonding
52%
Hybrid Bonding
50%
Through Silicon via
49%
3D IC
46%
Wafer Level
44%
Three-dimensional Integration
36%
Bonding Technology
34%
Heterogeneous Integration
32%
Wafer Bonding
29%
Electrical Performance
28%
Integrated Application
26%
Cu-Sn
25%
Wafer
25%
Bonding Structure
25%
Integration Scheme
25%
Bonding Quality
24%
Bonding Temperature
24%
Bonding Process
23%
Neural Sensing
21%
Passivation Layer
20%
Low-temperature Bonding
18%
Passivation
18%
Microsystems
17%
Microbump
16%
Fan-out
14%
Ultrathin
14%
Electrical Reliability
14%
Fine pitch
14%
Copper Wafer
13%
In(III)
13%
Buffer Layer
13%
Electrical Characteristics
12%
Bonding Interface
12%
Chip-level
12%
Cu TSV
11%
Polyimide
11%
Reliability Test
11%
Advanced Packaging
11%
Oxides
11%
Low Thermal Budget
11%
Redistribution Layer
11%
Thermo-compression Bonding
10%
3D Heterogeneous Integration
10%
Sensing Applications
10%
Fin Field-effect Transistor (FinFET)
10%
Wafer-level Packaging
9%
Back-end-of-line
9%
Interposer
9%
Engineering
Low-Temperature
93%
Interconnects
47%
Bonding Technology
45%
Wafer Bonding
41%
Electrical Performance
37%
Three Dimensional Integrated Circuits
32%
Passivation
31%
Bonding Temperature
26%
Direct Bonding
25%
Bonding Process
22%
Interposer
21%
Passivation Layer
21%
Microsystem
19%
Bonding Structure
18%
Technology Integration
16%
Reliability Analysis
16%
Copper Wafer
13%
Level Packaging
13%
Dielectrics
12%
Bonding Strength
12%
Silicon Dioxide
12%
Thin Films
11%
Electrical Measurement
10%
Sensing Application
10%
Bonded Structure
9%
Microelectromechanical System
8%
Buffer Layer
8%
Metal Layer
8%
Silicon Layer
8%
Joints (Structural Components)
8%
Silicon Substrate
8%
Manufacturability
7%
Reliability Assessment
7%
Bonding Material
7%
Integration Platform
7%
Bond Strength
7%
Cu Surface
7%
Integrated Circuit
6%
Eutectic Bonding
6%
Fits and Tolerances
6%
Process Flow
6%
Realization
6%
Bonding Mechanism
5%
Humidity Test
5%
Thermocompression Bonding
5%
Adhesion Layer
5%
Thermal Stress
5%
Nodes
5%
Process Development
5%
Creep
5%
