!!Projects per year
個人檔案
研究專長
三維積體電路(3D IC)、異質整合、先進封裝技術
經歷
2005/05~2009/01 IBM Watson Research Center 研究員
2012/02~迄今 國立交通大學電子工程學系/電子研究所教授
2015~迄今 國立交通大學國際半導體產業學院副院長
教育/學術資格
PhD, 電機工程與資訊科學, Massachusetts Institute of Technology
外部位置
指紋
查看啟用 Kuan-Neng Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
專案
- 30 已完成
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無凸塊結構之超薄晶圓堆疊技術實現超高頻寬記憶體與邏輯晶片系統平台
Chen, K.-N. (PI)
1/08/23 → 31/07/24
研究計畫: Other Government Ministry Institute
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三維積體電路與異質整合關鍵技術之低溫快速異質銅接合技術研究與平台開發
Chen, K.-N. (PI)
1/08/22 → 31/07/23
研究計畫: Other Government Ministry Institute
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無凸塊結構之超薄晶圓堆疊技術實現超高頻寬記憶體與邏輯晶片系統平台
Chen, K.-N. (PI)
1/08/22 → 31/07/23
研究計畫: Other Government Ministry Institute
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Advanced Thermal Solutions for Thin 3D: AlN 3D Heat Dissipation Network
Pai, S. L., Chang, S. P., Chang, C. C., Sung, P. J., Lin, N. C., Yang, C. C., Huang, K., Huang, G., Lin, J. & Chen, K. N., 2026, Proceedings - 2026 IEEE 76th Electronic Components and Technology Conference, ECTC 2026. Institute of Electrical and Electronics Engineers Inc., p. 1302-1307 6 p. (Proceedings - Electronic Components and Technology Conference).研究成果 › 同行評審
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A Novel Fan-Out Wafer Module Stacking Technology Using Transfer Bonding
Hsiao, C. C., Hsu, C. K., Wang, C. Y., Liu, Y. L., Wang, C. H., Lo, W. C., Chen, K. N. & Chang, S. C., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026. Institute of Electrical and Electronics Engineers Inc., p. 21-22 2 p. (2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026).研究成果 › 同行評審
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Hierarchical 3D-Vertically staking with Multi-layer and Stacking with Novel Structure by Transferrable Cu/polymer Hybrid Bonding and 3D-Vertically Stacking For High speed Digital Applications
Lee, O. H., Chan, Y. P., Chiu, W. L., Chang, H. H., Chiang, C. W., Peng, J. W., Chen, M. H., Chen, K. N., Lin, J. R., Chang, L. C., Fan, J. W., Chien, D. C., OuYang, T. Y., Wang, C. H., Lo, W. C., Lee, C. H., Tan, C. A. & Chang, S. C., 2026, Proceedings - 2026 IEEE 76th Electronic Components and Technology Conference, ECTC 2026. Institute of Electrical and Electronics Engineers Inc., p. 2035-2041 7 p. (Proceedings - Electronic Components and Technology Conference).研究成果 › 同行評審
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Mechanisms of room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN/nanocrystalline-nanotwinned Cu hybrid joints
He, P. S., Chen, H. Y., Chiang, Y. W., Kao, C. C., Huang, B. C., Song, G., Zhang, P., Chiu, W. L., Hsu, M. P., Chen, K. N., Lee, C. C., Liu, Y. L., Chen, K. Y. & Chen, C., 1 8月 2026, 於: Applied Surface Science. 736, 166787.研究成果: Article › 同行評審
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Next-Generation Optical-Electrical Co-Design Interconnect Using Low-Temperature Hybrid Bonding Technology
Su, L. C., Yeh, J. Y., Liu, Y. L., Li, C. T., Hsiung, C. K., Yang, Y. T., Wu, S. H., Ebisawa, K., Irie, M., Lee, C. J., Chang, Y. C. & Chen, K. N., 2026, Proceedings - 2026 IEEE 76th Electronic Components and Technology Conference, ECTC 2026. Institute of Electrical and Electronics Engineers Inc., p. 350-357 8 p. (Proceedings - Electronic Components and Technology Conference).研究成果 › 同行評審
獎項
活動
- 1 Invited talk