每年專案
個人檔案
研究專長
三維積體電路(3D IC)、異質整合、先進封裝技術
經歷
2005/05~2009/01 IBM Watson Research Center 研究員
2012/02~迄今 國立交通大學電子工程學系/電子研究所教授
2015~迄今 國立交通大學國際半導體產業學院副院長
教育/學術資格
PhD, Massachusetts Institute of Technology
外部位置
指紋
查看啟用 Kuan-Neng Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
網路
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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新南向及全球先進國家優秀外國青年學子來臺蹲點計畫(TEEP@AsiaPlus)
1/10/19 → 30/06/23
研究計畫: Ministry of Education(Include School)
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Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration
Chang, L. P., Wang, J. J., Hung, T. H., Chen, K. N. & Ouyang, F. Y., 1 2月 2022, 於: Applied Surface Science. 576, 151845.研究成果: Article › 同行評審
1 引文 斯高帕斯（Scopus） -
Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-first and Die-first Fan-Out Wafer-Level Packaging (FOWLP)
Lee, C. H., Huang, B., See, J., Prenger, L., Lin, Y. M., Chiu, W. L., Lee, O. H. & Chen, K. N., 2022, (Accepted/In press) 於: IEEE Transactions on Components, Packaging and Manufacturing Technology.研究成果: Article › 同行評審
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Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System
Ku, S. Y., Chou, T. C., Tsai, Y. C., Chou, T. C., Hu, H. W., Fang, Y. R., Lin, Y. J., Huang, P-T., Chiou, J-C. & Chen, K-N., 2021, Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 1020-1025 6 p. (Proceedings - Electronic Components and Technology Conference; 卷 2021-June).研究成果: Conference contribution › 同行評審
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Asymmetric low temperature cu-polymer hybrid bonding with Au passivation layer
Weng, M. W., Mao, S. Y., Liu, D., Hu, H. W. & Chen, K. N., 19 4月 2021, VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings. Institute of Electrical and Electronics Engineers Inc., 9440101. (VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings).研究成果: Conference contribution › 同行評審
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Atomic Layer Deposition Plasma-Based Undoped-HfO2Ferroelectric FETs for Non-Volatile Memory
Luo, J. D., Lai, Y. Y., Hsiang, K. Y., Wu, C. F., Chung, H. T., Li, W. S., Liao, C. Y., Chen, P. G., Chen, K. N., Lee, M. H. & Cheng, H. C., 8月 2021, 於: Ieee Electron Device Letters. 42, 8, p. 1152-1155 4 p., 9465799.研究成果: Article › 同行評審
2 引文 斯高帕斯（Scopus）
獎品
活動
- 1 Invited talk