每年專案
個人檔案
研究專長
三維積體電路(3D IC)、異質整合、先進封裝技術
經歷
2005/05~2009/01 IBM Watson Research Center 研究員
2012/02~迄今 國立交通大學電子工程學系/電子研究所教授
2015~迄今 國立交通大學國際半導體產業學院副院長
教育/學術資格
PhD, 電機工程與資訊科學, Massachusetts Institute of Technology
外部位置
指紋
查看啟用 Kuan-Neng Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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過去五年中的合作和熱門研究領域
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無凸塊結構之超薄晶圓堆疊技術實現超高頻寬記憶體與邏輯晶片系統平台
Chen, K.-N. (PI)
1/08/23 → 31/07/24
研究計畫: Other Government Ministry Institute
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無凸塊結構之超薄晶圓堆疊技術實現超高頻寬記憶體與邏輯晶片系統平台
Chen, K.-N. (PI)
1/08/22 → 31/07/23
研究計畫: Other Government Ministry Institute
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三維積體電路與異質整合關鍵技術之低溫快速異質銅接合技術研究與平台開發
Chen, K.-N. (PI)
1/08/22 → 31/07/23
研究計畫: Other Government Ministry Institute
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Advancements in single-crystal silicon with elevated-laser-liquid-phase-epitaxy (ELLPE) for monolithic 3D ICs
Shih, B. J., Pan, Y. M., Chung, H. T., Lin, N. C., Yang, C. C., Huang, P. T., Cheng, H. C., Shen, C. H., Shieh, J. M., Wu, W. F., Chen, K. N. & Hu, C., 1 4月 2024, 於: Japanese journal of applied physics. 63, 4, 04SP30.研究成果: Article › 同行評審
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A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications
Huang, Y. C., Lin, Y. X., Hsiung, C. K., Yang, Y. T., Hung, T. H. & Chen, K. N., 1 3月 2024, 於: Ieee Electron Device Letters. 45, 3, p. 452-455 4 p.研究成果: Article › 同行評審
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Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration
Shih, B. J., Pan, Y. M., Wang, C. Y., Chiu, H. Y., Yang, C. C., Shen, C. H., Cheng, H. C. & Chen, K. N., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2167-2171 5 p. (Proceedings - Electronic Components and Technology Conference).研究成果: Conference contribution › 同行評審
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A Review on Hybrid Bonding Interconnection and Its Characterization
Hsiung, C. K. & Chen, K. N., 1 4月 2024, 於: IEEE Nanotechnology Magazine. 18, 2, p. 41-50 10 p.研究成果: Article › 同行評審
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Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging
Wang, C. Y., Hung, T. H., Liu, P. J. & Chen, K. N., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2157-2162 6 p. (Proceedings - Electronic Components and Technology Conference).研究成果: Conference contribution › 同行評審
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