每年專案
個人檔案
研究專長
三維積體電路(3D IC)、異質整合、先進封裝技術
經歷
2005/05~2009/01 IBM Watson Research Center 研究員
2012/02~迄今 國立交通大學電子工程學系/電子研究所教授
2015~迄今 國立交通大學國際半導體產業學院副院長
教育/學術資格
PhD, 電機工程與資訊科學, Massachusetts Institute of Technology
外部位置
指紋
查看啟用 Kuan-Neng Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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網路
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration
Hong, Z. J., Liu, D., Hu, H. W., Hsiung, C. K., Cho, C. I., Chen, C. H., Liu, J. H., Weng, M. W., Hsu, M. P., Hung, Y. C. & Chen, K. N., 1 2月 2023, 於: Applied Surface Science. 610, 155470.研究成果: Article › 同行評審
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Scheme for Multi-Chiplet Integration with Low Thermal Budget by Asymmetric Cu-Cu Bonding with Au Passivation Bonding Structure
Hong, Z. J., Weng, M. W., Chen, C. H., Hsu, M. P., Hu, H. W., Lin, T. Y., Hung, Y. C. & Chen, K. N., 2023, (Accepted/In press) 於: Ieee Electron Device Letters. p. 1 1 p.研究成果: Article › 同行評審
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A hybrid bonding interconnection with a novel low-temperature bonding polymer system
Lin, Y. M., Chang, P. C., Lee, O. H., Chiu, W. L., Chang, T. C., Chang, H. H., Lee, C. H., Huang, B., Dong, M., Tsai, D., Lee, C. C. & Chen, K. N., 2022, Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Institute of Electrical and Electronics Engineers Inc., p. 2128-2134 7 p. (Proceedings - Electronic Components and Technology Conference; 卷 2022-May).研究成果: Conference contribution › 同行評審
1 引文 斯高帕斯（Scopus） -
An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology
Zhang, J., Lu, W., Huang, P. T., Li, S. H., Hung, T. Y., Wu, S. H., Dai, M. J., Chung, I. S., Chen, W. C., Wang, C. H., Sheu, S. S., Chen, H. M., Chen, K. N., Lo, W. C. & Wu, C. I., 2022, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., p. 262-263 2 p. (Digest of Technical Papers - Symposium on VLSI Technology; 卷 2022-June).研究成果: Conference contribution › 同行評審
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Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration
Chang, L. P., Wang, J. J., Hung, T. H., Chen, K. N. & Ouyang, F. Y., 1 2月 2022, 於: Applied Surface Science. 576, 151845.研究成果: Article › 同行評審
5 引文 斯高帕斯（Scopus）
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