跳至主導覽
跳至搜尋
跳過主要內容
國立陽明交通大學研發優勢分析平台 首頁
English
中文
首頁
人員
單位
研究成果
計畫
獎項
活動
貴重儀器
影響
按專業知識、姓名或所屬機構搜尋
查看斯高帕斯 (Scopus) 概要
邱 俊誠
教授
電控工程研究所
h-index
h10-index
h5-index
1924
引文
23
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
445
引文
11
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
32
引文
3
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
1995 …
2024
每年研究成果
概覽
指紋
網路
計畫
(48)
研究成果
(257)
獎項
(55)
類似的個人檔案
(6)
指紋
查看啟用 Jin-Chern Chiou 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Keyphrases
3D Integration
16%
Actuation
24%
Actuator
15%
Antenna
17%
Autofluorescence
13%
Biocompatibility
13%
Carbon Nanotube Composites
10%
CMOS-MEMS
31%
Commercially Available
10%
Complementary Metal Oxide Semiconductor
10%
Composite Beam
10%
Contact Lens
19%
Dry Electrodes
11%
Epilepsy
12%
Flip-chip Bonding
11%
Gas Sensor
16%
Holographic Optical Element
17%
Image Sensor
15%
Image Stabilizer
21%
Intraocular Pressure
13%
Intraocular Pressure Monitoring
19%
MEMS Fabrication Process
11%
MEMS-based
18%
Micro-electro-mechanical Systems
37%
Micromachining
10%
Micromirror
19%
Micromirror Device
17%
Microprobe Array
13%
Microsystems
37%
Multi-walled Carbon Nanotubes (MWCNTs)
16%
Neural Sensing
42%
Optical pickup
10%
Optical pickup Head
11%
Oral Cancer Diagnosis
10%
Probe Array
15%
Residual Stress
16%
Sensing Applications
17%
Small Form Factor
22%
Smart Contact Lens
21%
Soft Contact Lens
17%
Stabilizer
11%
Systems-based
15%
Thermal Actuator
13%
Thermal Switch
16%
Three-dimensional (3D)
13%
Through Silicon via
24%
Wireless
33%
Wireless Power
12%
Wirelessly
15%
XY Stage
10%
Engineering
Actuation
27%
Amplifier
11%
Analog Front
12%
Antenna
27%
Applied Voltage
12%
Assembly Process
10%
Blue Light
9%
Bonding Wire
8%
Brain-Computer Interface
8%
Capacitive
14%
Cellphone
9%
Chip Bonding
8%
Comb Drive Actuator
13%
Complementary Metal-Oxide-Semiconductor
11%
Computer Simulation
8%
Control Design
8%
Electric Power Utilization
7%
Electrostatic Driving
8%
Electrostatic Force
42%
Energy Engineering
7%
Experimental Result
25%
Front End
17%
Gas Sensor
22%
Image Sensor
15%
Interposer
9%
Lens Sensor
12%
Low-Temperature
7%
Metal Layer
8%
Micro-Electro-Mechanical System
26%
Microelectromechanical System
100%
Micromirrors
30%
Microsystem
45%
Multi-Walled Carbon Nanotube
8%
Multibody Dynamics
11%
Numerical Example
10%
Optical Element
18%
Oscillator
10%
Phase Shifters
8%
Prestress
8%
Radio Frequency Identification
10%
Residual Stress
19%
Resonant Frequency
10%
Resonator
8%
Sensing Application
17%
Sensing System
9%
Sensor System
9%
Simulation Result
11%
Sliding Mode Control
8%
Stabilizer
24%
Thin Films
8%