Chen, F. C.,
Chen, C.,
Bharath, U. &
Chang, J-K.,
21 10月 2020,
International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings. IEEE Computer Society,
p. 103-104 2 p. 9268542. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2020-October).
研究成果: Conference contribution › 同行評審